WMSIC Electronic Components

LOWPOWER LP3992-18B5F

ModelLP3992-18B5F
PackageSOT-23-5
BrandLOWPOWER
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LOWPOWER LP3992-18B5F
Type
LOWPOWER
Minimum package
3000

Technical parameters

Electronic Component
300mV@(300mA)
Electronic Component
LOWPOWER
Electronic Component
300uVrms
Electronic Component
LP3992-18B5F
Electronic Component
1
Package
SOT-23-5
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.066g
Electronic Component
1
Features
Output
Electronic Component
BM0229970643
Operating Temperature
40℃~+125℃@(Tj)
Operating Voltage
5.5V
Output
Electronic Component
Output Voltage
1.8V
Output Current
300mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LP3992-18B5F 产品概述

一、产品简介

LP3992-18B5F 是微源半导体(LOWPOWER)推出的一款高性能低压差线性稳压器(LDO),为固定输出 1.8V 的正极单通道稳压方案。器件集成使能控制、热关断与过流保护,适用于对噪声、纹波抑制和低静态电流有严格要求的便携与工业应用。封装采用 SOT-23-5,占板面积小,便于空间受限的系统集成。

二、主要参数

  • 输出类型:固定(1.8V)
  • 输出电流:最大 300mA
  • 工作电压(输入):典型 5.5V(器件可在更高输入电压工作,参考规格书最大允许值)
  • 压差(Dropout):300mV @ 300mA
  • 静态电流(Iq):130µA(典型)
  • 使能:带使能端(EN)
  • 保护功能:热关断、过流限制
  • PSRR:76dB @ 1kHz
  • 输出噪声:300µVrms
  • 工作温度:-40℃ ~ +125℃(Tj)
  • 封装:SOT-23-5
  • 输出极性:正极,单通道

三、典型性能与优势

  • 低静态电流:130µA 的静态电流有助于延长电池供电产品的待机时间。
  • 优异的压差性能:300mV@300mA 的压差使其在低电压差条件下仍能提供稳定 1.8V 输出,适合从 3.3V 或更高电压降压到 1.8V 的方案。
  • 高 PSRR 与低噪声:在敏感模拟前端、射频或音频电路中能有效抑制输入端纹波干扰,改善系统信噪比。
  • 完整保护机制:集成热关断与过流保护,提升系统可靠性并简化外围保护电路设计。
  • 小型封装:SOT-23-5 有利于移动设备或空间受限电路板的布局。

四、典型应用场景

  • 无线通信与基带处理芯片的 1.8V 供电
  • 便携电子(穿戴设备、手持终端)低功耗电源模块
  • 模拟/传感器前端供电,以降低噪声对测量精度的影响
  • 工业控制系统中需稳定 1.8V 的数字或模拟子系统

五、封装与引脚(简要)

封装:SOT-23-5,标准五引脚排列便于表面贴装。器件带有使能(EN)管脚、输入(VIN)、输出(VOUT)、接地(GND)等常用引脚,具体引脚定义和封装图请参阅正式数据手册,便于正确焊接与连线。

六、电路设计与布局建议

  • 输出电容:为保证稳压器稳定与低噪声输出,建议在 VOUT 端使用低 ESR 陶瓷电容(如 1µF~10µF),并靠近器件 VOUT 与 GND 引脚放置。
  • 输入去耦:VIN 端靠近器件放置 1µF~4.7µF 陶瓷去耦电容,抑制输入瞬态与高频噪声。
  • 接地与散热:GND 应尽量采用低阻抗平面,SOT-23-5 封装散热受限,需注意走线加宽与引脚焊盘散热,避免长时间大电流输出导致过热触发热关断。
  • 使能控制:EN 管脚连接逻辑电平以实现上电排序或节能模式;若不使用,请按数据手册建议拉高或拉低以避免漂浮。

七、注意事项与可靠性

  • 在设计时应估算最大功耗 P = (VIN - 1.8V) × IOUT,根据 PCB 散热能力和环境温度进行热管理与电流限值设置,避免频繁触发热保护。
  • 器件噪声与 PSRR 性能随频率有所变化,敏感应用建议在布局上做好模拟与数字电源分隔。
  • 出于长期可靠性考虑,请根据实际工作温度和最大封装结温(Tj)进行裕量设计,并参考微源半导体提供的完整应用笔记与可靠性数据。

如需更详细的电气特性曲线、引脚排列图、典型应用电路或样片采购信息,请告知,我可以提供相应的数据手册节选和选型建议。

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