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LOWPOWER LP3997-33QVF
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- LOWPOWER LP3997-33QVF
- Type
- LOWPOWER
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- 60mV@(100mA)；180mV@(300mA)
- Electronic Component
- LOWPOWER
- Electronic Component
- 60uVrms
- Electronic Component
- LP3997-33QVF
- Electronic Component
- 1
- Package
- DFN-4-EP(1x1)
- Electronic Component
- Linear Regulator(LDO)
- Electronic Component
- 0.013g
- Electronic Component
- 1
- Features
- Output
- Electronic Component
- BM0230595838
- Operating Temperature
- 40℃~+150℃@(Tj)
- Operating Voltage
- 6V
- Output
- Electronic Component
- Output Voltage
- 3.3V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LP3997-33QVF 产品概述
一、产品简介
LP3997-33QVF 是微源半导体（LOWPOWER）推出的一款低压差、超低静态电流、固定输出 3.3V 的线性稳压器（LDO），输出通道数为单路，输出极性为正极。器件采用 DFN-4-EP（1 × 1 mm）超小封装，面向对尺寸、功耗和电源噪声敏感的便携与物联网终端设计。
二、主要规格与性能
- 输出类型：固定（3.3V）
- 最大工作电压（Vin）：6V
- 最大输出电流：300 mA
- 压差（Dropout）：60 mV @ 100 mA；180 mV @ 300 mA
- 静态电流（Iq）：2 µA（超低待机功耗，适合电池供电）
- 输出噪声：60 µVrms（低噪声，适合模拟前端与 RF 前端）
- 电源纹波抑制比（PSRR）：65 dB（在关键频段可显著抑制输入纹波）
- 工作温度范围（Tj）：-40 ℃ ~ +150 ℃
三、保护机制与可控性
- 带使能引脚（EN）：支持外部使能/关断，实现电源管理与电源时序控制，降低系统待机功耗。
- 短路保护：在输出短路或严重过流时限制电流，保护器件与负载。
- 热关断：当结温过高时自动关闭输出，提高可靠性并防止热失控。
四、封装与热管理
DFN-4-EP（1×1 mm）小尺寸封装非常适合空间受限的应用。封装带有底部散热焊盘（Exposed Pad），建议在 PCB 上通过大面积铜箔和过孔将焊盘与内/下层地平面连接，以提升热阻性能和散热能力，保证在 300 mA 输出条件下稳定工作。
五、PCB 布局建议
- 在 VIN 引脚附近放置输入旁路电容，减小输入导线感抗；输出侧放置低 ESR 陶瓷电容，保证 LDO 稳定性与瞬态响应（常用 1µF~10µF X5R/X7R 陶瓷）。
- 将器件底部散热焊盘完整焊接到 PCB，使用多盏过孔连接至内/底层接地铜箔以提升散热和回流性能。
- 将 VIN、VOUT 和 GND 的走线尽量短且粗，EN 控制线与高噪声信号隔离。输入/输出电容尽量靠近引脚焊盘放置。
六、典型应用与选型建议
适用于便携设备、电池供电的 IoT 终端、传感器节点、模拟前端供电、RF/无线模块的低噪声供电、以及需要严格待机功耗控制的应用场景。选择时若需更高输出电流或特殊电压调整，需比较其他型号；对 EN 阈值或环路稳定条件有特殊要求时，建议参阅完整数据手册以确认外围元件规格及使能逻辑电平。
七、小结
LP3997-33QVF 以其 3.3V/300mA 输出能力、极低静态电流（2 µA）、小压差与低噪声特性，结合短路保护、使能和热关断等可靠性设计，适合对能耗、尺寸和电源质量有较高要求的现代便携与嵌入式系统。合理的 PCB 热设计和合适的旁路/输出电容选择可充分发挥该器件的性能。若需进一步参数（如 EN 阈值、详细稳压环路条件），建议查阅厂商完整资料或联系我们获取支持。
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