WMSIC Electronic Components

LOWPOWER LP6462HB6F

ModelLP6462HB6F
PackageSOT-23-6
BrandLOWPOWER
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LOWPOWER LP6462HB6F
Type
LOWPOWER
Minimum package
3000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LOWPOWER
Electronic Component
LP6462HB6F
Electronic Component
1
Package
SOT-23-6
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.052g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0230634439
Operating Temperature
40℃~+85℃@(TA)
Operating Voltage
4.5V~30V
Switching Frequency
1MHz
Electronic Component
Electronic Component
Output Voltage
600mV~7V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LP6462HB6F 产品概述

一、产品简介

LP6462HB6F 是一款降压型同步整流开关稳压器,工作电压范围宽(4.5V~30V),输出电压可调(600mV~7V),最大输出电流可达2A。内置开关管并采用1MHz开关频率,封装为SOT-23-6,静态工作电流仅300µA,适合对体积、效率和静态功耗有要求的便携及工业类点载应用。器件工作环境温度范围为 -40℃ 至 +85℃(TA)。

二、关键特性

  • 宽输入电压:4.5V ~ 30V,兼容常见电池与车载电源输入。
  • 可调输出:支持 0.6V ~ 7V 输出,参考基准为 600mV(用于反馈设定)。
  • 输出能力:最大连续输出电流 2A,适合为 MCU、传感器及外围供电。
  • 高频工作:1MHz 开关频率,有利于减小外部电感与电容体积。
  • 同步整流:内置同步 MOSFET,降低整流损耗、提升轻载及中载效率。
  • 低静态电流:Iq ≈ 300µA,适合低功耗待机场景。
  • 小封装:SOT-23-6,便于空间受限设计。

三、典型应用

  • 便携式设备、手持终端和可穿戴设备电源管理。
  • 工业控制与测量仪表的点载电源。
  • 汽车电子子系统(在满足车规要求前提下)及广泛的电源轨降压转换。
  • MCU、FPGA、模拟前端等模块的局部供电。

四、设计要点与建议

  • 反馈设定:采用外部分压器设定输出电压,满足 VOUT = 0.6V × (1 + Rtop/Rbottom)。
  • 电感选择:选择直流电阻(DCR)低、额定电流高于实际输出电流的电感(建议预留20%~50%裕量),并根据所需电流纹波与开关频率选择合适电感值。
  • 电容选择:输入/输出侧应使用低ESR陶瓷电容(X5R/X7R),输入电容放置靠近输入引脚以抑制瞬态环路,输出电容根据纹波和稳定性要求选择合适容值与低ESR特性。
  • PCB 布局:缩短开关回路(VIN、SW、输入电容)路径,减小寄生电感和电磁干扰;将敏感信号(FB、EN)远离高频开关节点。必要时针对SW节点增加散热铜箔或过孔改善热性能。
  • 热管理:尽管器件集成度高,但在高输入-低输出或高负载工况下功耗上升,需评估封装热阻与PCB散热能力,保证工作温度在器件额定范围内。

五、外围器件与系统整合

  • 开关频率1MHz 带来外置器件的小型化机会,但应权衡电感损耗与电容纹波要求。
  • 同步整流降低二极管损耗,推荐在高效率要求场合采用合适布局与低DCR电感以发挥优势。
  • 适配不同系统时注意输入瞬态(如发动机启停、浪涌)和输出启动/软启动需求,可通过外部元件或器件使能/软启动功能配合实现。

总结:LP6462HB6F 以其宽输入、可调输出、内置开关与同步整流、低静态电流及小封装特性,适合对体积、效率和待机功耗有综合要求的降压电源设计。在具体设计中,合理选型电感、电容并优化PCB布局与热处理,能充分发挥该器件在多种应用场景下的性能。若需典型电路原理图或参考布局建议,可提供更具体的设计参数以便生成示例。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.