WMSIC Electronic Components

LOWPOWER LP3321QVF

ModelLP3321QVF
PackageTDFN-6-EP(2x2)
BrandLOWPOWER
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LOWPOWER LP3321QVF
Type
LOWPOWER
Minimum package
4000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LOWPOWER
Electronic Component
LP3321QVF
Electronic Component
1
Package
TDFN-6-EP(2x2)
Electronic Component
LEDDriver
Electronic Component
PWM; Analog
Electronic Component
0.024g
Electronic Component
1
Channel Count
1
Features
(OVP); Built-in; (OTP)
Electronic Component
BM0228785270
Operating Temperature
40℃~+85℃
Switching Frequency
1MHz
Electronic Component
Electronic Component
Operating Voltage(DC)
2.5V~5.5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LP3321QVF 产品概述

一、产品简介

LP3321QVF 是 LOWPOWER(微源半导体)推出的一款单通道升压型 LED 驱动芯片,面向体积受限且对效率与电磁兼容有要求的便携与嵌入式照明应用。器件集成了高频开关管,开关频率为 1MHz,输入电压范围宽(DC 2.5V~5.5V),支持 PWM 与模拟两种调光方式,封装为小尺寸 TDFN-6-EP(2×2),适合空间受限的 PCB 布局。

二、核心特点

  • 工作电压:DC 2.5V~5.5V,适配锂电、USB 及常见单/双节电池系统
  • 开关频率:1MHz,便于使用小尺寸电感与电容,减小方案体积
  • 通道数:1 路,专为单组或串联白光/指示灯 LED 驱动设计
  • 调光方式:支持 PWM 和 模拟(电流/电压)两种调光,兼顾高效与高精度亮度控制
  • 拓扑结构:升压(Boost),内置开关管,无需外置功率开关
  • 保护功能:具备过压保护(OVP)、过温保护(OTP)和欠压保护(UVP),提高系统可靠性
  • 工作温度:-40℃~+85℃,满足工业级温度要求
  • 封装:TDFN-6-EP(2×2),带热沉焊盘,利于热管理和小型化设计

三、功能与保护机制说明

LP3321QVF 在电源与输出异常时提供多重保护:OVP 可防止输出或负载侧电压超限对芯片或 LED 的损坏;OTP 在器件温度过高时进入热关断或降额工作,避免热失控;UVP 在输入电压低于安全工作范围时对工作状态进行保护或关断,防止不稳定工作对输出或负载造成影响。三种保护相互配合,提升整机可靠性与使用寿命。

四、调光与控制建议

  • PWM 调光:建议使用高于人眼感知频率(通常 >200Hz)的 PWM 信号以避免可见闪烁;更高频率有利于光谱稳定性,但需注意开关产生的 EMI 与开关损耗。
  • 模拟调光:通过调节反馈或设定电流点实现连续亮度控制,适用于要求平滑渐变或低频调光场景。
  • 控制接口:器件通常提供使能/调光引脚,具体电平与驱动能力请参照详细数据手册;若外接 MCU 控制 PWM,建议采用推挽或开漏配合上拉/下拉电阻以确保电平稳定。

五、典型应用场景

  • 手机、平板与便携设备的背光或补光 LED 驱动
  • 可穿戴设备与智能家居的小型指示灯或装饰照明
  • 低功耗便携手电、阅读灯与微型投影光源驱动
  • 工业或医疗设备中需要稳定单通道升压驱动的小型光源模块

六、封装与热设计要点

TDFN-6-EP(2×2)封装带中央热沉焊盘,有利于热量快速传导至 PCB。建议在 PCB 设计中:

  • 在器件下方打足够的露铜并通过多处过孔连至背面散热层;
  • 输入端与输出端布线尽量短且宽,提高抗干扰能力并减少寄生电感;
  • 在开关节点附近合理放置旁路电容和布局地线,降低 EMI;
  • 选择适合 1MHz 工作频率的小尺寸低损耗电感与低 ESR 电容,兼顾体积与效率。

七、设计注意事项

LP3321QVF 为升压拓扑的控制核心,实际方案中需配合合适的无源元件(电感、输入/输出电容、反馈电阻等)以满足输出电流与电压精度要求。布板时优先考虑电源回流路径与散热能力,调试阶段建议关注开关波形、输出电压/电流和器件温升,确认在不同负载与环境温度下保护动作逻辑符合系统需要。

总结:LP3321QVF 以小尺寸封装、1MHz 高频开关和多重保护为核心优势,适用于对体积和可靠性有较高要求的单通道升压 LED 驱动场景。欲获取引脚定义、典型电路与详细电气特性,请参考 LOWPOWER 官方数据手册。

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