WMSIC Electronic Components

LOWPOWER LP6483SPF

ModelLP6483SPF
PackageESOP-8
BrandLOWPOWER
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LOWPOWER LP6483SPF
Type
LOWPOWER
Minimum package
4000 个

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LOWPOWER
Electronic Component
LP6483SPF
Electronic Component
1
Package
ESOP-8
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.116g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0229362025
Operating Temperature
40℃~+85℃@(TA)
Operating Voltage
4.5V~30V
Switching Frequency
340kHz
Electronic Component
Electronic Component
Output Voltage
600mV~12V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LP6483SPF 产品概述

一、产品简介

LP6483SPF 是 LOWPOWER(微源半导体)推出的一款降压型同步整流开关稳压器,适用于输入电压范围较宽、电源效率和尺寸受限的分布式电源设计。器件内置功率开关,单通道输出,支持可调输出电压,输出电流最高可达 3A,开关频率固定为 340kHz,工作温度范围 -40℃ ~ +85℃(TA)。封装为 ESOP-8,便于散热和 PCB 布局。

二、主要参数

  • 功能类型:降压(同步整流)
  • 输入电压:4.5V ~ 30V
  • 输出电压:0.6V ~ 12V(可调,参考电压 600mV)
  • 输出电流:最大 3A
  • 开关频率:340kHz(固定)
  • 同步整流:内置(高效率)
  • 静态电流 Iq:约 10mA
  • 开关管:内置开关管
  • 通道数:1
  • 拓扑结构:降压式(Buck)
  • 封装:ESOP-8
  • 工作温度:-40℃ ~ +85℃(TA)

三、功能亮点

  • 宽输入电压(4.5–30V),可直接用于车载、工业和电池供电系统;
  • 输出电压下限 0.6V,适合低压核心供电需求;
  • 内置同步整流开关,提升转换效率,降低外部元件数量;
  • 固定 340kHz 开关频率,在效率与电感体积之间有良好折中;
  • ESOP-8 封装利于热量扩散,适合 3A 级别输出。

四、设计与选型要点

  • 输出电压设置:器件参考电压为 600mV,使用反馈分压器 Rtop(上)与 Rbot(下)设置输出电压: Vout = VREF × (1 + Rtop / Rbot),其中 VREF = 0.6V。建议选择高精度电阻以保证稳压精度。
  • 电感选型:按占空比与纹波电流计算,ΔI ≈ 20%~40% × Iout 为常用目标。器件工作在固定频率 Fs = 340kHz,可用公式估算电感值: L = (Vin − Vout) × D / (ΔI × Fs),其中 D ≈ Vout / Vin。选用饱和电流高于最大输出电流且损耗低的功率电感。
  • 输入/输出电容:优先采用低 ESR 陶瓷电容以减少纹波和提升瞬态响应;输入端靠近 VIN 和 GND 引脚放置大容量去耦;输出侧并联陶瓷 + 选型电解/钽电容可改善低频稳定性。
  • 版图注意:缩短高电流环路(VIN、SW、GND、输出电容)走线,确保散热铜皮连通;反馈分压器尽量靠近 FB 引脚且与噪声源隔离,避免长走线引入抖动。
  • 热管理:ESOP-8 底部建议配合大面积铜箔散热,并在底铜铺设过孔通往内层/底层散热区,确保在 3A 输出下热阻可控。

五、保护与可靠性建议

LP6483SPF 本身集成同步开关以提升效率,但在不同应用下建议参考完整数据手册确认是否内置过流、过温、欠压保护等功能。系统设计中可通过外部熔断器、热保护与合适的电感/电容选型提升系统可靠性。

六、典型应用场景

  • 工业控制与电源模块;
  • 车载子系统(符合电压范围要求的情况下);
  • 通信设备与分布式电源;
  • 嵌入式主板、FPGA/MCU/ASIC 的核心或外围供电。

七、结论与建议

LP6483SPF 以宽输入、内置开关与同步整流、可调 0.6V 起输出、3A 输出能力及 340kHz 的工作频率,适合需要高集成度和良好效率的中功率降压场合。实际设计时请结合官方数据手册核对详细引脚定义、保护特性、典型应用电路与元件建议,按上述布局与元件选型原则进行 PCB 设计与热管理,从而获得稳定可靠的电源性能。

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