WMSIC Electronic Components

LOWPOWER LP3993-30B3F

ModelLP3993-30B3F
PackageSOT-23
BrandLOWPOWER
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LOWPOWER LP3993-30B3F
Type
LOWPOWER
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
300mV@(100mA)
Electronic Component
LOWPOWER
Electronic Component
LP3993-30B3F
Electronic Component
1
Package
SOT-23
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.047g
Electronic Component
1
Electronic Component
BM0230808556
Operating Temperature
40℃~+85℃@(Tj)
Operating Voltage
24V
Output
Electronic Component
Output Voltage
3V
Output Current
200mA
Output Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LP3993-30B3F 产品概述

一、概述与核心参数

LP3993-30B3F 是微源半导体(LOWPOWER)推出的一款高性能低压差线性稳压器(LDO),为单路正输出固定 3.0V 版本。器件采用 SOT-23 小型封装,设计目标为低功耗、低压差与高可靠性,适合电池供电与工业供电系统中对稳压精度和待机功耗有严格要求的应用场景。主要参数如下:

  • 输出类型:固定(3.0V)
  • 最大工作电压(输入允许范围):可支持至 24V 级别的输入电压
  • 输出电流:最大 200mA
  • 压差(典型):300mV @ 100mA
  • 静态电流(Iq):约 5 μA(极低静态电流,利于待机能耗优化)
  • 保护功能:过流保护、热关断
  • 工作温度范围:-40℃ ~ +85℃(Tj)
  • 输出极性:正极输出
  • 通道数:1
  • 封装:SOT-23

二、主要特性与优势

  • 低压差(Low Dropout):300mV@100mA 的低压差特性,使其在输入电压接近输出电压时仍能维持稳定输出,适用于电池电压逐渐下降的系统。
  • 极低静态电流:5 μA 典型静态电流非常适合电池供电和物联网终端等需要长续航的设备,可显著降低待机功耗。
  • 保护功能完善:内置过流保护(OCP)与过热关断(TSD),提高系统在异常条件下的可靠性与安全性。
  • 小型封装:SOT-23 封装体积小,便于在空间受限的 PCB 上布局,适合便携式和消费类电子产品。

三、典型应用场景

  • 低功耗物联网和传感节点(供给 MCU、传感器前端)
  • 便携式设备与电池供电产品(手持设备、遥控器)
  • 工业控制与自动化系统中由 24V 总线降压至 3.0V 的局部稳压
  • 通信模块、电源管理前端与参考电源

四、设计注意事项

  • 输入/输出旁路电容:为保证稳压器稳定工作,输入端与输出端应放置适当的低 ESR 电容(常见推荐值范围为 1 μF ~ 10 μF,具体值依系统要求与器件数据手册而定),并尽量靠近封装引脚布置。
  • 热管理:尽管器件带有热关断保护,但在高输入电压与大输出电流工况下会产生较大功耗(Pd ≈ (Vin - Vout) × Iout),建议在 PCB 上增加铜箔面积以利散热,避免长期工作在高结温区。
  • 瞬态响应:若系统负载突降突增明显,可在输出端适当增加旁路或抑制电路以改善瞬态响应及抑制振铃。
  • PCB 布局:建议短而粗的输入、输出回流路径,地线采用单点回归或通过大平面接地以降低噪声与接地电阻。

五、封装与选型建议

LP3993-30B3F 提供 SOT-23 小型封装,适合紧凑布局。选型时注意确认系统最大输入电压、所需持续输出电流与功耗散热能力;若系统在高温或长时间大电流工作,需评估绝热与散热设计,必要时选择更大封装或外部散热手段。

六、结论

LP3993-30B3F 以其低静态电流、低压差和完整的保护机制,适用于对能耗与体积敏感的稳压场合。其支持高达 24V 的输入能力和 200mA 的输出能力,使其在电池供电与工业 24V 总线降压场景中具有良好的适配性。实际设计采用前,请结合官方数据手册确认输入/输出电容、热性能与典型应用电路,以获得最佳稳定性与可靠性。

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