WMSIC Electronic Components

MICROCHIP MCP2542FD-E/SN MCP2542FD

ModelMCP2542FD-E/SN
PackageSOIC-8
BrandMICROCHIP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MICROCHIP MCP2542FD-E / SN
Type
SOIC-8
Minimum package
100 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MICROCHIP
Electronic Component
MCP2542FD-E/SN
Electronic Component
1
Package
SOIC-8
Type
CAN-FDTransceiver
Electronic Component
CAN Transceiver
Electronic Component
0.169g
Electronic Component
1
Channel Count
1
Features
Integrated Level positions; ESD; Low Power; Bus
Electronic Component
BM0226476600
Operating Temperature
40℃~+125℃
Operating Voltage
4.5V~5.5V
Operating Current
70mA
Data
8Mbps

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MCP2542FD-E/SN 产品概述

一、产品简介

MCP2542FD-E/SN 是 MICROCHIP(美国微芯)出品的一款单通道 CAN‑FD 收发器,采用标准 SOIC‑8 封装,面向汽车与工业级 CAN‑FD 总线应用。器件支持宽温工作范围(-40℃ 至 +125℃),在 5V 供电下提供可靠的物理层接口,并兼顾高数据速率与低功耗待机特性,适合要求兼容经典 CAN 与 CAN‑FD 系统的设计。

二、主要规格

  • 类型:CAN‑FD 收发器(单通道,1-1 CANbus)
  • 供电电压:4.5V ~ 5.5V
  • 工作电流(发送/驱动峰值或典型):70 mA
  • 数据速率:最高 8 Mbps(CAN‑FD 数据阶段)
  • 静态/待机电流:≈ 15 µA
  • 通道数:1
  • 工作温度:-40℃ ~ +125℃
  • 封装:SOIC‑8
    说明:以上参数以典型/目标值为主,具体时序与极限参数请参阅原厂数据手册。

三、关键特性

  • 支持 CAN‑FD 高速数据阶段,满足对更高带宽的需求。
  • 提供低功耗待机模式(静态电流约 15 µA),便于整车或电源受限系统的能耗管理。
  • 单通道设计、SOIC‑8 封装,便于在现有 PCB 布局中替换或升级。
  • 工作温度覆盖工业/车用等级,适配恶劣环境下的可靠通信需求。
  • 在 5V 电源下稳定工作,适配传统车载与工业供电架构。

四、应用场景

  • 汽车车身控制单元(BCM)、车载网关与门控模块
  • 动力电池管理(BMS)与电机控制器的车内通信
  • 工业自动化与楼宇控制系统中需要抗干扰高速总线的场合
  • 需要兼容经典 CAN 与向 CAN‑FD 升级的嵌入式节点

五、设计与使用建议

  • 电源去耦:靠近 VCC 放置 0.1 µF(或与 1 µF 串联)陶瓷去耦电容以抑制瞬态噪声。
  • 总线终端:在 CANH 与 CANL 之间采用 120 Ω(或根据网络拓扑调整)的终端电阻,必要时使用可切换终端或偏置网络。
  • 抗干扰保护:总线外部可并联 TVS 二极管与共模电感以提高瞬态与共模干扰抑制能力。
  • PCB 布局:CAN 总线线对宜并行且走短路径,收发器与变压器/电源分区应注意信号与地分离。
  • 参考手册:出于正确引脚连接、时序配置和电气极限考虑,设计前务必参阅 Microchip 原厂数据手册与应用说明。

六、封装与替换注意

MCP2542FD-E/SN 提供 SOIC‑8 标准封装,便于工程样板与量产开发。若替换其他厂商同类器件,请核对工作电压、待机功能、容错保护、引脚排列与认证级别,确保系统兼容与功能一致。

七、总结

MCP2542FD‑E/SN 针对需在 -40℃ 至 +125℃ 环境中运行的 CAN‑FD 系统,兼顾高速通信(最高约 8 Mbps)与低功耗待机(≈15 µA),并以 5V 供电、SOIC‑8 封装提供简便的硬件替换路径。适用于汽车与工业场景中对可靠性与带宽有较高要求的节点,实际使用时请按原厂资料完成电气连接与 EMC 抑制设计。

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