WMSIC Electronic Components

MEIHUA MHT153IRCT

ModelMHT153IRCT
Package1206
BrandMEIHUA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MEIHUA MHT153IRCT
Type
MEIHUA
Minimum package
2000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MEIHUA
Electronic Component
MHT153IRCT
Electronic Component
1
Package
1206
Electronic Component
940nm
Electronic Component
Infrared Emitter
Electronic Component
30°
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0228149330
Operating Temperature
40℃~+85℃
Current
20mA;100mA
Electronic Component
14mW/sr@IF=20mA;36mW/sr@IF=20mA
(Vf)
1.2V;1.6V
Power Dissipation(Pd)
100mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MHT153IRCT 产品概述

一、产品简介

MHT153IRCT 是美华(MEIHUA)推出的一款1206封装正贴球头红外发射二极管,发射峰值波长940nm,典型视角30°,用于近距红外通信、感测与照明场景。小型球头设计在保持紧凑尺寸的同时提供良好的方向性和辐射强度,适合贴片自动化生产和空间受限的终端设备。

二、主要参数与特性

  • 波长(λp):940nm(红外不可见光谱)
  • 正向电压(Vf):典型 1.2V,最大约 1.6V(随电流略有变化)
  • 正向电流:典型工作 IF = 20mA;最高(脉冲)可达 100mA(需限制占空比与脉宽)
  • 耗散功率(Pd):100mW
  • 直流反向耐压(Vr):5V
  • 辐射强度:分档提供 14 mW/sr@20mA 与 36 mW/sr@20mA 两种等级(按订单选择)
  • 视角:30°(半值角,方向性强)
  • 工作温度:-40℃ ~ +85℃
  • 封装:1206 SMD,球头透镜,有利于光束集中与发射效率

三、典型应用场景

  • 红外遥控与数据通信(短距离点对点)
  • 距离/接近传感器、障碍检测模块
  • 夜视辅助照明与红外补光(配合相机或CMOS感光器)
  • 安防与入侵检测系统中的发射端
  • 工业自动化中的状态指示与光电开关配合使用

四、设计与使用建议

  • 驱动与限流:建议以恒流驱动或在串联限流电阻下工作。限流电阻可由公式 R = (Vcc - Vf) / IF 计算;例如 Vcc=5V、IF=20mA 时 R ≈ 190Ω(可选 180Ω~220Ω)。
  • 功率与散热:连续工作以20mA为典型值,功耗 Pd = Vf × IF,应保证PCB散热与环境温升控制,避免超过100mW耗散上限。
  • 脉冲驱动:若需更高辐射强度可采用脉冲驱动,脉冲峰值不超过100mA,并严格限制占空比与脉宽以防过热与寿命缩短。
  • 反向保护:反向耐压仅为5V,电路中应避免反向高压,建议加入反向并联二极管或限压保护电路。
  • ESD与装配:器件对静电敏感,应在防静电环境下贴片与焊接;推荐遵循生产厂商的储存与装配注意事项。
  • 回流焊:适配常规无铅回流工艺(详见供应商回流曲线),焊接温度与时间应参照产品资料以避免透镜变形或性能下降。

五、封装与选型提示

1206球头封装兼顾尺寸与光学性能,适用于SMT自动化线。针对不同应用可选辐射强度档位(14 mW/sr 或 36 mW/sr),在对比光束需求与功耗预算时合理选型。若需更宽视角或更大输出功率,请与美华技术支持沟通以获取替代型号或定制方案。

六、可靠性与储存

  • 工作环境建议保持在产品额定温度范围内(-40℃~+85℃)。
  • 长期储存应防潮并在吸湿盒内保存,若开封后需按MSL等级回流焊接。
  • 推荐在产品应用初期进行寿命与环境应力验证(温度循环、湿热与振动),确保在目标场景下的稳定性与可靠性。

结语:MHT153IRCT 以其窄视角、高方向性和1206小型封装,适合空间受限且需集成自动贴装的红外发射应用。选型时关注工作电流、辐射强度档位与热管理,可获得稳定且高效的发射性能。若需完整电气与回流工艺资料,请联系美华(MEIHUA)获取数据手册与推荐使用说明。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.