WMSIC Electronic Components

Mini-Circuits PHA-1+

ModelPHA-1+
PackageSOT-89-3
BrandMini-Circuits
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Mini-Circuits PHA-1+
Type
MINI-CIRCUITS
Minimum package
1500 圆盘

Technical parameters

IP3
42dBm
P1dB
22.4dBm
Electronic Component
Electronic Component
Electronic Component
MINI-CIRCUITS
Electronic Component
PHA-1+
Electronic Component
13.5dB
Electronic Component
1
Package
SOT-89-3
Electronic Component
RFAmplifier
Electronic Component
0.209g
Frequency
50MHz~6GHz
Electronic Component
1
Features
Linear
Electronic Component
BM0264771103
Noise Figure
2.2dB
Operating Temperature
40℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PHA-1+ 产品概述

一、产品简介

PHA-1+ 是 Mini‑Circuits 推出的一款表面贴装(SMT)线性放大器,工作频率覆盖 50 MHz 至 6000 MHz,采用 50Ω 设计并封装于 SOT‑89‑3。该器件针对宽带接收与前端放大应用进行了线性化设计,兼顾增益、噪声和线性度,适合对动态范围和线性性能有较高要求的系统。

二、主要电气参数

  • 频率范围:50 MHz ~ 6 GHz
  • 增益:典型 13.5 dB
  • 噪声系数:典型 2.2 dB
  • 供电电压:4.8 V ~ 5.2 V
  • 工作电流:约 146 mA
  • 1 dB 压缩点(P1dB):22.4 dBm
  • 三阶互调点(IP3):42 dBm
  • 输入回波损耗(S11):11.3 dB(典型)
  • 输出回波损耗(S22):17.1 dB(典型)
  • 工作温度范围:-40 ℃ ~ +85 ℃

三、功能与优势

  1. 线性化设计:高 IP3(42 dBm)和较高的 P1dB(22.4 dBm)保证在多信号环境下的低互调失真与良好动态范围。
  2. 宽带覆盖:50 MHz–6 GHz 的宽频带能力,适配多种无线标准与测试频段,减少器件替换与通用型设计复杂度。
  3. 低噪声:2.2 dB 的噪声系数为接收链提供良好灵敏度提升,适合前端放大使用。
  4. SMT 封装:SOT‑89‑3 的小型表贴封装便于自动化贴装与批量生产。

四、典型应用

  • 无线通信基站接收链前端增益块
  • 射频测试与测量设备的宽带放大模块
  • 卫星接收、微波链路和多频段接收机
  • 仪表、雷达与干扰监测系统中的线性放大器

五、安装与设计要点

  • 供电与旁路:建议使用稳压 5 V 电源,靠近器件放置高频旁路电容(如 0.1 μF 与 10 nF 并联)以抑制电源噪声。
  • 匹配与布局:器件为 50Ω 输入/输出,通常无需外部阻抗匹配,但建议采用 50Ω 微带线路、短回流路径和充分的地平面以保证稳定性与回波性能。
  • 热管理:SOT‑89‑3 为小封装,长时间高功率工作时注意 PCB 铜箔散热与必要的散热通孔(thermal vias)布置。
  • 封装与焊接:遵循 Mini‑Circuits 给出的参考封装图与焊盘模板,避免产生过多热应力或焊盘浮焊。
  • 外部器件:根据系统需要可在输入/输出加入直流隔离电容、交流耦合器或肖特基二极管保护电路。

六、采购与资料

器件型号:PHA‑1+(Mini‑Circuits,SOT‑89‑3 封装)。具体的曲线图、引脚定义、封装尺寸与环境认证信息请参照 Mini‑Circuits 官方数据手册与工程样片评估结果,以确保在目标应用中的性能符合要求。

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