WMSIC Electronic Components

Mini-Circuits GVA-93+

ModelGVA-93+
PackageSOT-89
BrandMini-Circuits
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Mini-Circuits GVA-93+
Type
MINI-CIRCUITS
Unit
Electronic Component
Minimum package
1000

Technical parameters

IP3
31.1dBm
P1dB
16.3dBm
Electronic Component
Electronic Component
Electronic Component
MINI-CIRCUITS
Electronic Component
GVA-93+
Electronic Component
15.2dB
Electronic Component
1
Package
SOT-89
Electronic Component
RFAmplifier
Electronic Component
0.202g
Frequency
10MHz~9GHz
Electronic Component
1
Electronic Component
BM0265000500
Noise Figure
5.3dB
Operating Temperature
40℃~+85℃
Operating Voltage
4.8V~5.2V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GVA-93+ 射频放大器产品概述

一 概述

GVA-93+ 为 Mini-Circuits 提供的一款射频增益块,覆盖 10 MHz 至 9 GHz 的宽频带工作范围。该器件在小型化和低功耗前提下提供稳定的增益提升与良好的线性性能,适合系统中作为驱动级、缓冲放大或增益补偿单元使用。产品符合 RoHS 要求,适配多种商业与工业环境。

二 主要性能参数

  • 频率范围:10 MHz ~ 9 GHz
  • 增益:15.2 dB(典型)
  • 噪声系数:5.3 dB(典型)
  • 工作电压:4.8 V ~ 5.2 V
  • 工作电流:52 mA(典型)
  • 输出 1 dB 压缩点(P1dB):+16.3 dBm
  • 三阶截点(IP3):+31.1 dBm
  • 输入回波损耗(S11):24.9 dB(典型,表示输入匹配优良)
  • 输出回波损耗(S22):31 dB(典型,输出匹配优秀)
  • 工作温度范围:-40 ℃ ~ +85 ℃

三 电气与热特性解析

GVA-93+ 在 5 V 供电下工作电流约 52 mA,功耗低,便于嵌入功耗受限的系统。15.2 dB 的增益为中高增益级别,配合输入/输出优良的匹配(S11/S22 分别约 -24.9 dB 与 -31 dB),在大多数系统中可直接以 50 Ω 介面连接,无需额外匹配网络。噪声系数约 5.3 dB,虽非极限低噪声放大器,但在作为中间增益级或驱动级时能提供良好信噪比保持。P1dB=+16.3 dBm 与 IP3=+31.1 dBm 表明器件具有良好的线性能力和动态范围,适用于对互调与压缩点有一定要求的链路设计。

四 典型应用场景

  • 通信基站的中频/射频驱动与缓冲级
  • 测试与测量仪器的宽带增益模块
  • 雷达信号链的前端后级放大与信号复用驱动
  • 卫星通信与无线回传链路中的放大与接口衔接
  • 需要低功耗、宽带和良好匹配的便携式设备

五 实际使用建议

  • 供电与旁路:使用稳压 5 V 电源,建议在近端放置高频旁路电容(例如 0.1 μF + 10 nF 并联)并做好接地平面。
  • 射频接口:由于输入/输出匹配良好,通常可直接 50 Ω 连接;若系统存在不同偏置,建议在 RF 端加入 DC 阻断电容。
  • 热管理:器件功耗较低,但在密集布局或高环境温度下仍需良好散热与接地处理。
  • PCB 布局:保持地平连续,使用过孔进行地回流,射频走线尽量短且控制阻抗,电源走线应做去耦和滤波。
  • 级联设计:在级联多个放大器时注意总体噪声系数与压缩点的累积效应,可依据 Friis 公式评估链路性能并选择合适前置级以优化系统 NF。

六 认证与封装信息

品牌:Mini-Circuits,RoHS 合规。封装信息未提供,设计时请依据具体样片或数据手册确认焊盘与机械尺寸,并在量产前核实封装与热性能。

七 小结

GVA-93+ 是一款覆盖宽频、增益适中、线性与匹配表现优良的射频增益块,适用于多种通信与测试系统的驱动或缓冲场合。其低功耗与宽温度范围使其在工业级与商用系统中都具备较高的实用价值。设计集成时关注电源去耦、地处理与热管理即可发挥器件的预期性能。若需更详细的 S 参数、时域或失真曲线,请参考 Mini-Circuits 的完整技术手册或联系供应商获取器件样品与评估板。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.