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Mini-Circuits ADTT1-1+
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- Mini-Circuits ADTT1-1+
- Type
- MINI-CIRCUITS
- Unit
- Electronic Component
- Minimum package
- 1000
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MINI-CIRCUITS
- Electronic Component
- ADTT1-1+
- Electronic Component
- 1
- Electronic Component
- 6.91mm
- Package
- SMD-6P,7.9x5.6mm
- Electronic Component
- (balun)
- Electronic Component
- 0.257g
- Electronic Component
- 7.87mm
- Electronic Component
- 2.84mm
- Electronic Component
- 2°
- Electronic Component
- 1
- Electronic Component
- BM0265000496
- Operating Temperature
- 20℃~+85℃
- Frequency
- 300kHz~300MHz
- Electronic Component
- 1000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ADTT1-1+ 产品概述
一、产品简介
ADTT1-1+ 是 Mini‑Circuits 出品的一款表面贴装（SURF MOUNT）射频信号变压器 / 音频/信号变压器，符合 RoHS 要求。它属于 RF XFMR 类器件，提供不平衡/平衡之间的 1:1 阻抗转换，常用于宽带信号耦合、隔离、平衡/不平衡转换以及射频电路中的阻抗匹配与共模抑制。
二、主要电气参数
- 频率范围：300 kHz ～ 300 MHz（宽带覆盖，从低频音频到 VHF 区域均可使用）
- 阻抗比（不平衡/平衡）：50Ω : 50Ω（1:1）
- 插入损耗（最大）：3 dB（包含铁损与馈线损耗，设计时需考虑）
- 相位差：2°（良好的幅相平衡，适合差分信号处理）
- 幅度差（最大）：0.15 dB（幅度平衡优异）
- 回波损耗（最小）：18 dB（对应较低的反射，VSWR 性能可接受）
- 工作温度：-20 ℃ ～ +85 ℃
三、机械尺寸与封装
- 外形尺寸：长 7.87 mm × 宽 6.91 mm × 高 2.84 mm，体积小、适合高密度 PCB 布局。
- 封装类型：表面贴装（具体封装引脚布局请参考 Mini‑Circuits 官方数据手册，实际 PCB 尺寸和焊盘形状需按厂方推荐的布局设计）。
四、典型应用场景
- 宽带射频前端的平衡/不平衡转换（例如天线输入与差分放大器之间）
- 差分信号耦合与隔离，降低共模干扰
- 宽带滤波器、混频器和均衡器的阻抗匹配
- 测试测量仪器及通讯设备中的信号分配与衰减网络
五、使用建议与设计要点
- PCB 布局：尽量缩短变压器到关键器件的连接线，差分线路长度匹配，避免在高频段引入寄生走线。焊盘周围使用充分的地平面并布置回流孔（via）以保证屏蔽和参考地完整性。
- 热与环境：器件工作温度范围为 -20 ℃～+85 ℃，在高温或受潮环境下需考虑可靠性与老化。
- 匹配考虑：回波损耗 ≥18 dB 表明在 50Ω 系统中反射小，但在严格的高频应用中仍建议在系统级做仿真验证（S参数仿真）。
- 安装工艺：采用标准 SMD 回流焊工艺，注意按制造商回流温度曲线控制焊接温度与时长，避免过温损伤磁心或绝缘材料。
六、注意事项
- 插入损耗最高 3 dB 意味着本器件在转换过程中会有一定能量损失，设计增益链路时需预留裕量。
- 若需更详细的电气模型（S参数文件）或封装引脚图，应向 Mini‑Circuits 获取官方资料以便精确仿真与布局。
- 储存与防潮：长时间存放应保持干燥、防尘，遵循电子元器件储存规范。
如需用于特定频段的性能曲线、S参数文件或 PCB 焊盘建议图，可提供进一步资料，便于完成电路仿真与版图优化。
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