WMSIC Electronic Components

Mingda Micro MD7039

ModelMD7039
PackageSOT-89-3
BrandElectronic Component
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MD7039
Type
Mingda Micro
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MD7039
Electronic Component
1
Package
SOT-89-3
Electronic Component
Supervisorand positions IC
Electronic Component
0.032g
Electronic Component
1
Electronic Component
BM0264548265
Operating Temperature
40℃~+85℃@(TA)
Operating Voltage
1.5V~15V
ICType
Voltage Detector
Output Type
Electronic Component
Voltage
3.9V
Static Current(Iq)
220nA
Supervisor Voltage
1

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MD7039 产品概述

一、概述

MD7039 是明达微推出的一款低功耗电压检测器,采用高耐压 NMOS 开漏输出结构,专为系统上电、掉电和欠压保护设计。芯片工作电压范围宽(1.5V 至 15V),检测阈值为 3.9V,复位信号为低电平有效,适用于单路电压监控场合。器件封装为 SOT-89-3,工作温度范围 -40℃ 至 +85℃,可在多种消费类与工业应用中替代传统复位解决方案。

二、主要特性

  • 检测阈值:VTH = 3.9V(低电平有效复位)
  • 工作电压范围:1.5V 至 15V,支持多种电源轨监控
  • 输出类型:高耐压 NMOS 开漏(需外部上拉)
  • 受监控电压通道数:1 路
  • 超低静态电流:典型值 220 nA;静态功耗场景下可至 1.2 μA(取决于工作电压与负载)
  • 工作温度:-40℃ ~ +85℃(TA)
  • 封装:SOT-89-3,利于散热与自动化贴装
  • 品牌:明达微(MD)

三、典型应用场景

  • MCU、DSP 等数字系统的上电复位(Brown-out / Power-on Reset)
  • 电池供电设备的欠压保护与监控
  • 电源管理与电源序列控制
  • 通信设备、路由器、电源适配器
  • 工业控制与消费电子中需要可靠复位的场合

四、功能与接线说明

MD7039 工作时,将被监控的电源 VCC 直接连接到芯片的 VCC 引脚,GND 接地。当 VCC 低于 3.9V 检测阈值时,芯片输出端(RESET)被拉低,产生低电平复位信号;当 VCC 提升超过阈值并稳定后,开漏输出释放,外部上拉电阻将输出拉到高电平,解除复位。由于输出为开漏结构,用户应根据系统逻辑电平选择合适的上拉电阻与上拉电压(上拉电压不得超过器件最大工作电压 15V)。

典型接线:

  • VCC → 被监控电源
  • GND → 0V
  • RESET(开漏)→ 上拉电阻 → 上拉电源(通常为 VCC 或系统逻辑电源)

五、设计要点与注意事项

  • 上拉电阻选择:建议根据上拉电压与系统对上升时间的要求选择 10 kΩ ~ 100 kΩ;上拉电压不得超过 15V。
  • 复位有效电平为低:系统设计时请使用低电平有效的复位输入或采用反向逻辑处理。
  • 启动与抖动:实际应用中建议在 RESET 端增加滤波或在 MCU 端实施去抖措施,以防系统在电源临界区产生误动作。
  • 温度与偏差:在极端温度下阈值可能有一定偏差,应用于关键系统时请参考器件完整规格书中的温度系数与容差数据进行裕量设计。
  • EMC 与布局:将 VCC 与 GND 引脚邻近布线,必要时在 VCC 与 GND 之间加旁路电容,以提高抗干扰性能与稳定检测。

六、封装与可靠性

MD7039 提供 SOT-89-3 封装,体积小、散热性能好,适合表面贴装工艺。器件通过工业级温度范围验证,适合车载非严苛场合、工业控制与消费电子。出货前建议参考明达微提供的完整数据手册以获取详细的绝对最大额定值、典型电性曲线与封装尺寸资料。

总结:MD7039 以其宽工作电压、高耐压开漏输出、超低静态电流与紧凑封装,适合各种需要可靠复位与欠压监控的电子系统,是单路电压检测与系统复位设计的实用器件选择。若需详细电气特性或评估样片,建议联系明达微或查阅 MD7039 的完整规格书。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.