WMSIC Electronic Components

Milliohm HOGS2512-5MR-3W-1% HOGS2512

ModelHOGS2512-5MR-3W-1%
Package2512
BrandMilliohm
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Milliohm HOGS2512-5MR-3W-1%
Type
MILLIOHM
Minimum package
1000 圆盘

Technical parameters

Power
3W
Electronic Component
Electronic Component
Electronic Component
MILLIOHM
Electronic Component
HOGS2512-5MR-3W-1%
Electronic Component
1
Package
2512
Electronic Component
Current Sense Resistor / Shunt
Electronic Component
±1%
Electronic Component
0.113g
Electronic Component
5mΩ
Electronic Component
1
Electronic Component
BM0264980414
Electronic Component
SMD
Resistor Type
Current Sense Resistor
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HOGS2512-5MR-3W-1% 产品概述

一、产品简介

HOGS2512-5MR-3W-1% 为 Milliohm(毫欧)品牌的表贴式电流采样电阻(分流器),阻值 5 mΩ,额定功率 3 W,精度 ±1%,封装 2512(约 6.35 mm × 3.2 mm)。该器件专为电流检测与电源管理设计,具有低阻值、低压降和高功耗处理能力的特点,适合在电机驱动、电池管理与开关电源等需要高精度电流反馈的系统中使用。

二、主要特性

  • 阻值:5 mΩ,精度 ±1%(出厂标称)
  • 额定功率:3 W(在良好散热条件下)
  • 封装:2512 表贴,利于自动贴片与回流焊工艺
  • 低压降:在理论连续允许电流约 24.5 A 时电压降约 122 mV(V=I×R),实际允许电流受 PCB 散热与环境温度影响需按热设计折算

三、电气与热性能分析

  • 连续电流估算:I = sqrt(P/R) ≈ sqrt(3 / 0.005) ≈ 24.5 A(此为理论值,实际使用中需考虑 PCB 铜箔面积、过孔散热和环境温度的降额)
  • 压降与功耗关系:工作电流加大时自热会引起电阻上升及额定功率限制,应关注在额定电流下的温升和长期稳定性
  • 精度影响因素:自热、焊接应力与温度系数会影响实际测量精度,设计时应留有裕量

四、封装与安装建议

  • 推荐使用较大铜箔散热区(顶部和底部)并通过过孔连接到内层或底层大铜箔以提升散热能力
  • 焊接:采用标准回流焊工艺,遵循厂家焊接曲线,避免长时间高温以减小漂移
  • 测量接线:建议在采样电阻两端采用四线(Kelvin)测量法,以消除连接导线与焊盘电阻的影响

五、典型应用场景

  • 电池管理系统(BMS)与充放电检测
  • 开关电源(SMPS)中的电流保护与限流反馈
  • 电机控制器与驱动器电流环检测
  • 电源适配器、配电检测与功率计量前端

六、选型与测试要点

  • 按系统最大工作电流和散热条件计算实际功耗与温升,必要时选用更大功率或在 PCB 上增加散热铜箔/散热片
  • 进行四端低电流精密测量以验证出厂阻值,随后在目标工作电流下测量温升与漂移
  • 确认长期循环温度下的稳定性与焊接可靠性,必要时与供应商确认温度系数与机械耐久性参数

七、采购与品质建议

  • 订购前确认封装、带卷/散装供货形式及质量证书(如 RoHS/表面处理等)
  • 若用于计量或高精度场合,建议索取样品并做批次一致性验证与老化测试
  • 对于量产,建议与供应商沟通可追溯的检验报告与长期供货保障

如需具体的温度系数(TCR)、冲击与老化数据或 PCB 推荐封装图库(land pattern),可联系供应商或提供更多系统工况以便给出更精确的热设计建议。

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