Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
KEMET T520B337M2R5ATE009是基美(KEMET)推出的聚合物钽电解电容,属于T520系列核心产品。基美作为全球无源电子器件领域的领军企业,拥有超过70年的钽电容技术积累,其产品以高可靠性、稳定性能和宽环境适应性著称,广泛应用于汽车、工业、消费电子等高端领域。该型号通过型号编码可快速对应核心参数:T520为系列标识,B代表封装类型,337表示容值330μF(33×10⁷pF),2R5为额定电压2.5V,ATE009为封装与编带规格,整体定位中高端紧凑空间的电源滤波/去耦场景。
该电容的电气性能聚焦低损耗、高稳定性,核心参数可支撑多场景需求:
该产品采用CASE-B-3528-21mm表面贴装(SMD)封装,具体尺寸为:长度3.5mm、宽度2.8mm、高度2.1mm。这种紧凑封装具备两大优势:
此外,CASE-B封装是钽电容的标准工业封装,可与同类产品互换,便于设计迭代。
基于参数特性,该电容主要覆盖三类核心场景:
KEMET对该产品进行了严格的可靠性测试,核心保障点包括:
相比同类产品,该电容的核心竞争力体现在:
综上,KEMET T520B337M2R5ATE009是一款专为低电压、紧凑空间、极端环境设计的高性能聚合物钽电容,可有效解决电源滤波、去耦场景中的纹波抑制、稳定性与小型化需求,是汽车、工业、消费电子领域的理想选择。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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