WMSIC Electronic Components

KEMET C0805C103K1RAC7800

ModelC0805C103K1RAC7800
Package0805
BrandKEMET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
KEMET C0805C103K1RAC7800
Type
KEMET
Unit
Electronic Component
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
KEMET
Electronic Component
C0805C103K1RAC7800
Electronic Component
1
Electronic Component
10nF
Package
0805
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.038g
Electronic Component
1
Electronic Component
BM0265815121
Electronic Component
X7R
Voltage
100V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

KEMET C0805C103K1RAC7800 多层陶瓷电容器(MLCC)产品概述

一、产品核心参数总览

KEMET C0805C103K1RAC7800是一款中温稳定型多层陶瓷电容器,核心参数清晰明确,可满足多数工业及消费电子场景的基础滤波、耦合需求:

  • 容值:10nF(标识代码"103",即10×10³pF);
  • 精度:±10%(代码"K",符合工业级通用精度要求);
  • 额定电压:100V DC(交流应用需参考降额曲线);
  • 温度系数:X7R(行业标准分类,-55℃至+125℃范围内电容变化率≤±15%);
  • 封装:0805(英制代号,对应公制2012尺寸:2.0mm×1.2mm×0.8mm典型高度);
  • 材质:多层陶瓷(MLCC),X7R介质(钛酸钡基陶瓷,兼顾稳定性与成本)。

二、关键性能与材质特性

X7R介质是该产品的核心优势,相比其他常用陶瓷介质,具有明显的场景适配性:

  1. 温度稳定性:-55℃+125℃宽温范围下,电容变化率控制在±15%以内,优于Y5V(±20%+80%),可适应工业环境的温度波动;
  2. 容值范围:比C0G(NP0,高精度高频)的容值覆盖更广(10nF属于中值范围),适合一般滤波而非高频精密振荡;
  3. 电压特性:额定100V DC下,直流偏置导致的电容降额相对温和(典型降额10%~20%,需查 datasheet 确认),交流应用时建议峰值电压不超过70V(降额70%)。

三、封装与尺寸规格

0805封装是表面贴装(SMD)领域的主流紧凑封装,适配高密度PCB设计:

  • 公制尺寸:长2.0±0.2mm,宽1.2±0.2mm,高0.8±0.1mm;
  • 焊盘建议:焊盘长1.01.2mm,宽0.60.8mm,焊盘间距0.2~0.3mm(符合IPC-A-610标准),便于自动化贴装;
  • 包装形式:通常采用12mm或16mm编带包装,每盘数量为3000~5000只,适配标准SMT产线。

四、典型应用场景

该产品因性能均衡、成本可控,广泛应用于以下领域:

  1. 工业控制:PLC模块、伺服驱动器、传感器接口的滤波/耦合电路(适应-40℃~+85℃工业环境);
  2. 消费电子:机顶盒、路由器、智能家居设备的电源纹波抑制、信号耦合;
  3. 通信设备:基站、路由器的中低频段旁路电容(配合电感实现EMI滤波);
  4. 电源模块:DC-DC转换器的输入/输出滤波(抑制开关噪声);
  5. 汽车电子(若为AEC-Q200级):车载中控、胎压传感器的辅助滤波(需确认料号是否支持汽车级认证)。

五、选型与使用注意事项

为保证产品可靠性,需关注以下细节:

  1. 降额设计:
    • 直流电压:实际工作电压≤80V(额定值80%),避免长期过载;
    • 温度:工作温度≤+125℃,高温环境下建议额外降额10%电压;
  2. 焊接工艺:
    • 回流焊:峰值温度≤260℃,时间≤10秒(超过260℃需缩短至5秒内);
    • 波峰焊:温度≤250℃,时间≤5秒,避免陶瓷层开裂;
  3. 静电防护:ESD等级通常为2kV~4kV,操作时需戴防静电手环/手套,存储于防静电袋中;
  4. 存储条件:常温(15~35℃)、干燥(湿度≤60%)环境,存储期≤2年,超出需重新测试电性参数。

六、品牌与可靠性保障

KEMET(基美)作为全球被动元件龙头企业,为该产品提供可靠的质量背书:

  • 环保认证:符合RoHS 2.0(无铅)、REACH(无有害物质)标准;
  • 可靠性测试:通过IEC 60384-14(电子设备电容器标准),部分批次支持AEC-Q200(汽车级);
  • 质量控制:全流程自动化检测,缺陷率低于行业平均水平,支持定制化参数(如容值、精度微调)。

该产品以"性能均衡、成本可控、可靠性高"为核心特点,是工业及消费电子领域中10nF/100V MLCC的优选方案之一。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.