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KEMET C0603C225K8RAC7867
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- KEMET C0603C225K8RAC7867
- Type
- KEMET
- Unit
- Electronic Component
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- KEMET
- Electronic Component
- C0603C225K8RAC7867
- Electronic Component
- 1
- Electronic Component
- 2.2uF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.036g
- Electronic Component
- 1
- Electronic Component
- BM0265826597
- Electronic Component
- X7R
- Voltage
- 10V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
KEMET C0603C225K8RAC7867 多层陶瓷电容产品概述
C0603C225K8RAC7867是KEMET（基美）推出的通用型多层陶瓷电容（MLCC），针对低电压、小型化电路设计优化，核心参数覆盖容值2.2μF、额定电压10V、X7R温度系数，适配0603（1608公制）封装，广泛应用于消费电子、工业控制等领域。
一、产品核心参数与型号解析
1. 核心参数清单
项目 规格值 容值 2.2μF（标识225） 容值精度 ±10%（标识K） 额定电压 10V DC 温度系数 X7R（-55℃~+125℃） 封装 0603英制（1.6×0.8mm） 材质 多层陶瓷（MLCC） 品牌 KEMET2. 型号命名逻辑
型号各部分含义明确：
- C0603：封装规格（英制0603，对应公制1608）；
- C：陶瓷电容材质标识；
- 225：容值编码（22×10⁵pF=2.2μF）；
- K：容值精度（±10%）；
- 8R：额定电压关联标识（对应10V DC）；
- AC7867：生产批次/工艺代码（KEMET内部标识）。
二、电气性能与温度稳定性
X7R材质是核心优势，满足宽温场景需求：
- 温度特性：工作温度-55℃~+125℃，容值变化率≤±15%（行业标准），适配户外设备或工业高温环境；
- 电压性能：额定电压10V DC，额定温度内无明显漏电流（典型值<1μA@25℃）；
- 高频表现：低ESR（等效串联电阻），1kHz下损耗角正切（tanδ）≤5%，适合信号耦合、去耦。
三、封装与可靠性设计
0603封装（1.6mm×0.8mm×0.8mm）支持小型化，同时兼顾可靠性：
- 贴装适配：焊盘尺寸符合行业标准，兼容自动贴装（SMT）设备，贴装精度误差≤0.1mm；
- 环境兼容：符合RoHS 2.0、REACH标准，无铅焊接，耐260℃回流焊10s无失效；
- 机械强度：弯曲强度≥5mm（IPC标准），可承受PCB轻微形变，适合便携式设备振动场景。
四、典型应用场景
结合参数特性，主要应用于：
- 消费电子：手机/平板CPU供电模块去耦、音频信号耦合；
- 工业控制：小型PLC、传感器模块的信号旁路、电源稳压；
- 通信设备：路由器、WiFi模块的射频去耦、电源滤波；
- 医疗仪器：低功率监护仪的ECG模块去耦、信号处理电路。
五、选型优势与使用注意事项
1. 选型优势
- 品质一致：KEMET量产工艺成熟，容值偏差控制在±10%内，批次一致性好；
- 宽温适配：X7R覆盖工业级宽温，无需额外温度补偿；
- 小型集成：0603封装适合高密度PCB，节省空间。
2. 使用注意事项
- 电压降额：建议工作电压≤8V（降额20%），避免容值漂移；
- 焊接规范：遵循KEMET回流焊曲线（峰值245℃~260℃，时间≤10s）；
- 存储要求：常温干燥环境存储，开封后12个月内使用，避免焊盘氧化。
该电容凭借通用参数与可靠性能，成为低电压电路设计的常用选型，适配多种量产场景。
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