WMSIC Electronic Components

KEMET C0603V102KDRAC7867

ModelC0603V102KDRAC7867
Package0603
BrandKEMET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
KEMET C0603V102KDRAC7867
Type
KEMET
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
KEMET
Electronic Component
C0603V102KDRAC7867
Electronic Component
1
Electronic Component
1nF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.034g
Electronic Component
1
Electronic Component
BM0207721813
Electronic Component
X7R
Voltage
1kV
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

C0603V102KDRAC7867 产品概述

概况

C0603V102KDRAC7867 是一款由 KEMET(基美)生产的表面贴装多层陶瓷电容器(MLCC),其额定电压高达 1000V(1kV),电容值为 1000 pF,容差为 ±10%。该产品采用 X7R 材料技术,专为广泛的通用应用而设计,具备优良的温度稳定性和电气性能。

主要特性

  1. 高电压特性:本产品具有高达 1000V 的额定电压,是高压应用场合的理想选择,如工业设备、仪器仪表、汽车电子和通讯设备等领域,可以有效抵御电网波动和瞬态过电压。

  2. 电容值与容差:电容值为 1000 pF,能够满足各种电路中对小功率和高频信号的滤波和耦合需求。±10% 的容差确保了电容器在工作条件下的可靠性和一致性,适应性强。

  3. 操作温度范围:该电容器具备宽广的工作温度范围,从 -55°C 到 +125°C。这种耐高低温性能使得 C0603V102KDRAC7867 能在极端环境条件下稳定工作,非常适合用于航空航天、汽车及工业自动化等领域。

  4. X7R 介质:使用 X7R 材料技术,这种材料具有良好的介电特性和较小的温度系数,使其在宽温范围内维持稳定的电容值,适合于温度变化较大的应用环境。

  5. 小型封装:0603(1608 公制)的小型封装和最大厚度 0.035"(约 0.90mm)使得该电容器非常适合在空间有限的线路板上应用,能够帮助设计人员在满足功能需求的同时,节省板面积和体积。

  6. ArcShield™ 技术:该技术提供额外的可靠性,能够在高电压条件下防止电弧的形成,保护电路不受瞬态过电压的影响,增加了电容器在恶劣环境中的可靠性。

应用场景

C0603V102KDRAC7867 适用于多种电子电路及设备,包括但不限于:

  • 消费电子:如智能手机、平板电脑和家用电器等,提供稳压和滤波功能。
  • 汽车电子:满足汽车内部电力系统的高压和高频要求,增强整车电子设备的稳定性与安全性。
  • 工业控制:用于自动化设备、PLC 控制器及传感器,确保系统在各种工作环境下的可靠运行。
  • 通讯设备:在通讯基站及网络设备中执行信号耦合和滤波,有效降低电磁干扰。

结论

总之,C0603V102KDRAC7867 是一种高性能、多用途的表面贴装陶瓷电容器,具备高电压和宽温特性,适用于多个行业的各种电子应用。凭借其优良的电气性能和可靠的长期稳定性,C0603V102KDRAC7867 能为您的设计提供可靠的解决方案,是现代电子产品中不可或缺的重要元件。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.