WMSIC Electronic Components

KEMET C1206C475K5RACAUTO

ModelC1206C475K5RACAUTO
Package1206
BrandKEMET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
KEMET C1206C475K5RACAUTO
Type
KEMET
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
KEMET
Electronic Component
C1206C475K5RACAUTO
Electronic Component
1
Electronic Component
4.7uF
Package
1206
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.071g
Electronic Component
1
Electronic Component
BM0228089273
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

KEMET C1206C475K5RACAUTO 汽车级多层陶瓷电容(MLCC)产品概述

一、产品核心身份与定位

该型号为KEMET(基美) 推出的汽车级多层陶瓷电容(MLCC),型号各段标识对应明确:

  • C:多层陶瓷电容(MLCC)类型;
  • 1206:封装规格(英制1206,对应公制尺寸3.2mm×1.6mm);
  • 475:容值编码(47×10⁵ pF = 4.7 μF);
  • K:容值精度(±10%);
  • 5R:额定直流电压(50V DC);
  • ACAUTO:汽车级后缀,表明产品符合AEC-Q200可靠性标准,专为汽车电子及高可靠性工业场景设计。

二、关键电气性能参数

  1. 容值与精度:标称容值4.7 μF,精度±10%,覆盖大多数滤波、耦合、旁路电路的容值需求;
  2. 额定电压:50V DC,远高于汽车12V/24V系统工作电压,可有效应对瞬态过压(如负载突变、电磁干扰尖峰);
  3. 温度特性:采用X7R陶瓷介质,温度范围-55℃至+125℃,此区间内容值变化≤±15%,适配汽车发动机舱、低温启动等极端环境;
  4. 损耗特性:1kHz测试下,损耗角正切(tanδ)≤2.5%,低损耗减少电路能量损耗,提升系统效率。

三、物理封装与工艺特性

  1. 封装形式:1206贴片封装,无引线设计,兼容常规SMT生产线,贴装效率高;
  2. 尺寸规格:公制3.2mm(长)×1.6mm(宽)×1.2mm(最大厚度),体积紧凑,适配汽车电子小型化需求;
  3. 电极与端接:内部镍(Ni)电极,外部镍-锡(Ni/Sn)端接,符合RoHS 2.0及REACH环保标准,无铅;
  4. 工艺结构:多层陶瓷堆叠工艺,容值稳定性好,抗机械应力能力强。

四、可靠性与环境适应性

作为汽车级MLCC,该型号具备以下优势:

  1. AEC-Q200认证:通过汽车电子可靠性标准(Grade 1等级),涵盖温度循环、湿度偏压、振动、冲击等测试,确保汽车生命周期内稳定;
  2. 抗振动性能:可承受20g rms(20-2000Hz)随机振动,适配汽车行驶路面振动;
  3. 耐湿性能:通过85℃/85%RH湿度偏压(THB)测试,高湿环境下性能稳定;
  4. 长期稳定性:高温老化后容值变化≤±5%,25℃额定电压下漏电流≤10μA,远超商业级MLCC。

五、典型应用场景

  1. 汽车电子:
    • 动力系统:电机控制器(MCU)、DC-DC转换器、车载充电机(OBC)滤波;
    • 车身电子:中控、灯光控制、车窗升降器旁路电容;
    • 安全系统:ABS、安全气囊控制器信号滤波;
    • 信息娱乐:导航、音响音频耦合与电源滤波;
  2. 工业控制:工业机器人、PLC电源滤波,光伏/风电变流器辅助电路;
  3. 通信设备:基站电源模块、射频电路滤波(适配户外基站环境)。

六、选型与使用注意事项

  1. 电压余量:实际工作电压≤额定电压的80%(≤40V),预留瞬态过压余量;
  2. 温度匹配:确认环境温度在-55℃至+125℃内,超出需选X8R介质;
  3. 精度需求:需±5%精度可选X5R介质同封装型号,但X7R温度稳定性更优;
  4. 贴装工艺:1206封装需控制贴装压力与回流焊温度曲线,避免陶瓷开裂;
  5. 认证确认:汽车应用需确认AEC-Q200标识,该型号ACAUTO后缀已明确满足。

该型号凭借汽车级可靠性、宽温度范围与紧凑封装,成为汽车电子及高可靠性工业场景的优选MLCC。

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