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C0805C224K3RAC 是一款由 KEMET(基美)制造的多层陶瓷电容器(MLCC),其主要特性包括220nF的电容量、25V的额定电压、X7R介质材料,以及±10%的电容公差。这款电容器采用0805封装,适用于表面贴装(SMD)技术,是现代电子电路设计中不可或缺的基础元件之一。
X7R是陶瓷电容器中常用的一种介质材料,具有良好的温度稳定性、适当的电压系数以及合理的容量变化特性。X7R电容器的温度范围为-55°C到+125°C,能够在多种工作环境下保持稳定的性能,其电容值在该温度范围内变化有限,因此非常适合需要稳定性能的应用场合。
0805封装的尺寸为0.08英寸 x 0.05英寸(约2.0mm x 1.25mm),这使得C0805C224K3RAC电容器在空间受限的电路板上也能够方便地进行布置和焊接。较小的封装尺寸使其更适合现代小型电子设备,如智能手机、平板电脑、可穿戴设备等。
C0805C224K3RAC在众多电子应用中展现出卓越的性能,尤其适合以下场合:
KEMET对其产品的品质控制非常严格,C0805C224K3RAC电容器符合RoHS(限制使用某些有害物质指令)标准,无铅环保,适用于需要遵循严格环境法规的应用。此外,正确的存储条件和使用方法将进一步保证元件的长期性能。
总体而言,C0805C224K3RAC是功能强大、应用广泛且性能稳定的陶瓷电容器,非常适合用于各种电子产品和设备中。KEMET凭借其在电子元器件领域的深厚技术积累与创新,确保了这款电容器在性能和品质上的卓越表现,是工程师们推荐的理想选择。这款电容器不仅能满足设计对电容的高要求,同时也能在实际应用中表现出色,为电子产品的可靠运行提供保障。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
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The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
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The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
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Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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