Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
KEMET C0402C399C5GACTU
Configuration
1 options
Configuration
22+
Available for RFQ
Technical data
Product details
17
specifications
Core information
- Product name
- KEMET C0402C399C5GACTU
- Type
- KEMET
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- KEMET
- Electronic Component
- C0402C399C5GACTU
- Electronic Component
- 1
- Electronic Component
- 3.9pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.012g
- Electronic Component
- 1
- Electronic Component
- BM0214090423
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：C0402C399C5GACTU 贴片电容
1. 产品简介
C0402C399C5GACTU 是由著名的电子元件制造商 KEMET（基美）生产的一款高性能陶瓷贴片电容。这款电容器采用了表面贴装技术（MLCC），在众多电子应用中发挥着至关重要的作用。其额定电压为50V，电容值为3.9pF，同时具有低等效串联电感（ESL）的特性，保证了在高频应用中的性能稳定性。
2. 主要参数
- 电容量：3.9pF
- 额定电压：50V
- 工作温度范围：-55°C 至 125°C
- 尺寸：0.039" x 0.020" (1.00mm x 0.50mm)
- 厚度（最大值）：0.022"（0.55mm）
- 容差：±0.25pF
- 温度系数：C0G（NP0）
- 封装类型：0402（1005公制）
3. 特性与优势
C0402C399C5GACTU 采用了C0G (NP0) 温度特性，这种特性确保其电容量在整个温度范围内变化极小，提供了良好的温度稳定性。这使得该电容特别适合用于对稳定性要求极高的电路中，如高频信号处理、射频（RF）电路以及高精度电子设备中。同时，由于其低 ESL 特性，该电容在应用于高频和高速信号时可以有效减少信号干扰，提升整体信号完整性。
4. 应用场景
C0402C399C5GACTU 的应用涵盖了广泛的电子产品和领域：
- 消费电子：在手机、平板电脑和其他便携设备中，用于滤波、耦合和解耦。
- 通信设备：用于无线通信设备，如基站和路由器，适用于高速数据传输。
- 汽车电子：在汽车的各种电子控制单元（ECU）中，用于信号稳定性和去耦合。
- 工业设备：用于工业自动化和控制系统中，实现精确信号处理。
- 医疗设备：在医疗仪器中，保障设备在高温和低温环境下的可靠性。
5. 安装与使用
作为表面贴装电容，C0402C399C5GACTU 采用现代的 SMT 工艺，适合在自动化的组装过程中进行高效率的焊接。其0402尺寸适合于各种精密电子设备的紧凑设计，设计工程师可以轻松地将其集成到小型电路板中。同时，其厚度仅为0.55mm，使得在空间受限的场合也能保证良好的布局。
6. 结论
C0402C399C5GACTU 是一款集高性能、稳定性及小型化于一体的优质陶瓷贴片电容。无论是在消费电子、通信、汽车电子还是医疗设备等领域，这款电容都能为设计工程师提供卓越的性能支持。凭借其低 ESL、高稳定性和广泛的工作温度范围，该电容能够满足现代电子设备对高可靠性和高精度的严苛要求，是电子行业中不可或缺的重要元件。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
