WMSIC Electronic Components

KEMET T491B226M016AT

ModelT491B226M016AT
PackageCASE-B-3528-21(mm)
BrandKEMET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
KEMET T491B226M016AT
Type
KEMET
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
KEMET
Electronic Component
T491B226M016AT
Electronic Component
1
Electronic Component
22uF
Package
CASE-B-3528-21(mm)
Electronic Component
Capacitor
Electronic Component
±20%
Electronic Component
0.106g
Electronic Component
1
Electronic Component
BM0264817091
Operating Temperature
55℃~+125℃
Voltage
16V
Electronic Component
Electronic Component
Electronic Component
2000
Resistor(ESR)
2.2Ω@100kHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

T491B226M016AT 产品概述

一、产品基本参数

T491B226M016AT 为 KEMET(基美)系列钽电容,主要参数如下:容值 22 µF;额定电压 16 V;公差 ±20%;等效串联电阻(ESR)2.2 Ω @ 100 kHz;工作温度范围 -55 ℃~+125 ℃;封装标识 CASE-B-3528-21(片式钽电容典型体积,标称 3.5×2.8×2.1 mm 级别)。该型号属于固态钽电容,适合对体积、稳定性与长期可靠性有要求的电路。

二、特性与优点

  • 容量密度高:在小型化封装中提供 22 µF 的电容值,便于空间受限的电源去耦与滤波设计。
  • 低温漂与宽温区稳定性:在 -55 ℃ 至 +125 ℃ 工作范围内性能稳定,适用于工业与汽车电子等宽温场景(根据具体认证)。
  • 明确的 ESR 指标:2.2 Ω(100 kHz)便于设计高频去耦与噪声抑制时评估阻抗响应。
  • 制造商信誉:KEMET 为成熟电容制造商,可靠性及批次一致性较好。

三、典型应用

  • 开关电源输出滤波与去耦;
  • 低频/中频能量存储与瞬态响应补偿;
  • 工业控制、通信设备和部分汽车电子(需按具体车规等级确认);
  • PCB 上的去耦与旁路电容。

四、封装与安装建议

  • 为保证焊接与热循环可靠性,推荐按照 KEMET 的焊接曲线与回流温度规范进行工艺控制;
  • 钽电容为极性元件,焊装时必须明确正负极并在 PCB 丝印上作标识;
  • 建议在设计时留有适当间距以减小热应力,并避免在零件附近放置高温元件。

五、使用注意与可靠性建议

  • 极性敏感:不得施加反向电压,反向或突发过压易导致击穿或失效甚至起火;
  • 电压降额:为提高可靠性,建议实际工作电压按额定电压的 50%~80% 进行降额设计,尤其在高温或脉冲负载场合;
  • 限制冲击电流与浪涌:钽电容对浪涌电流敏感,电路应限制启动/切换时的电流峰值;
  • 储存条件:干燥、避光、防尘,避免长时间潮湿暴露,必要时使用密封包装并在规定时间内回流焊接。

六、选型与替代建议

  • 若需要更低 ESR 或更高纹波承受能力,可考虑铝电解固态或陶瓷多层电容(MLCC)作为替代或并联使用以改善瞬态响应;
  • 直替时选择相同性能等级(容值、公差、额定电压、ESR 与封装)或更优参数的型号,以确保可靠性与性能一致。

如需进一步提供尺寸图、耐久寿命曲线、焊接曲线或同系列其他电容型号对比,可告知我具体需求,我将补充更详尽的技术资料。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.