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Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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KEMET T521D107M025ATE060 是一款优质的钽电容,具有 25V 的额定电压和 100µF 的电容量,符合现代电子应用的高标准要求。作为表面贴装类型(SMD),该电容不仅在高频应用中展现出良好的性能,而且其小巧的尺寸和稳定的电气特性,使其在诸多场合中得到广泛使用。适用的工作温度范围为 -55°C 到 105°C,使得该器件适用于各种极端环境下的应用。
工作温度范围: T521D107M025ATE060 具有广泛的工作温度范围,从极低的 -55°C 到高达 105°C,使其适应于不同温度条件下的应用,确保长期稳定的性能。
耐用性: 在 125°C 环境下,这款电容具有 2000 小时的使用寿命,体现了其卓越的耐热性能和长期稳定性,适合长期运行的设备。
电容与电压: T521D107M025ATE060 的电容量为 100µF,额定电压为 25V,适合多种电路设计,能够有效地储存电能,支持剧烈变化的电流需求,适用于滤波、耦合和去耦等多种应用场景。
低ESR性能: 该电容在 100kHz 时的等效串联电阻(ESR)仅为 60 毫欧,这意味着在高频应用中具有良好的电性能和低功耗特性,减少了在信号传输过程中的能量损失。
封装与尺寸: 尺寸为 0.287" 长 x 0.169" 宽(7.30mm x 4.30mm),高度为 0.122"(3.10mm),符合 KEMET 的 D 尺寸代码,使其在设计板级空间紧凑的电子产品时具备良好的适配性。
容差: 该电容的容差为 ±20%,为设计师提供了一定的灵活性,确保在不同的应用条件下,仍旧能够保证可靠的电路性能。
由于其优良的性能特点,KEMET T521D107M025ATE060 广泛应用于以下领域:
KEMET T521D107M025ATE060 是一款性能卓越的钽电容,结合了小尺寸、高承载和良好的电气特性,适用于众多高科技领域。其可靠性和耐用性,使其成为设计师和工程师在开发各种电子设备时的重要选择。无论是在极端环境下还是在普通操作条件下,T521D107M025ATE060 都能为系统提供稳定的支持,满足现代电子设计的高标准需求。选择这款电容,将为您的项目增添一份可靠的保障。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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