Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
KEMET T520D337M006ATE025
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- KEMET T520D337M006ATE025
- Type
- KEMET
- Minimum package
- 500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- KEMET
- Electronic Component
- T520D337M006ATE025
- Electronic Component
- 1
- Electronic Component
- 330uF
- Package
- CASE-D-7343-31(mm)
- Electronic Component
- Capacitor
- Electronic Component
- ±20%
- Electronic Component
- 0.418g
- Electronic Component
- 1
- Electronic Component
- BM0000745334
- Operating Temperature
- 55℃~+105℃
- Voltage
- 6.3V
- Electronic Component
- Electronic Component
- Electronic Component
- 500
- Resistor(ESR)
- 25mΩ@100kHz
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
T520D337M006ATE025 产品概述
概述
T520D337M006ATE025 是一款由知名制造商 KEMET（基美）生产的高性能钽电容，具备优越的电气特性和广泛的应用潜力。该产品以其杰出的耐压能力及高均匀度，提高了电子设备的稳定性和可靠性。特别适合在空间受限及对电容容量有较高要求的应用场景中，T520D系列成为客户的优选。
主要参数
- 电压额定值: 6.3V
- 电容值: 330µF
- 工作温度范围: -55°C ~ 105°C
- 寿命: 在 105°C 环境下能够持续使用 2000 小时
- 容差: ±20%
- 等效串联电阻 (ESR): 25 毫欧 @ 100kHz
- 封装方式: 表面贴装型，尺寸为 0.287" 长 x 0.169" 宽（7.30mm x 4.30mm）
- 制造商尺寸代码: CASE-D-7343
- 高度: 最大安装高度为 0.122"（3.10mm）
设计特点
T520D337M006ATE025 钽电容具备优异的稳定性和广泛的工作温度范围，充分适应现代电子设备对温度和电气性能的严格要求。其极低的 ESR 值（25 毫欧 @ 100kHz）确保了其在高频应用中的有效性，能够减少电能在电容内部的损耗，提高能效。
此款电容的容差范围为 ±20%，这使其在电路设计中更具灵活性，能够很好地符合不同应用需求的变动。同时，其长达 2000 小时的工作寿命在众多高温应用中，可以显著降低因电容失效而导致的系统故障风险。
应用场景
T520D337M006ATE025 钽电容广泛应用于多个领域，包括但不限于：
- 消费电子: 例如智能手机、平板电脑和其他便携式电子设备中，提供有效的滤波和稳定电源。
- 汽车电子: 在汽车内部电子控制单元（ECU）及其他重要的电子系统中，为其提供电源支持和能量存储。
- 工业设备: 适用于需要高可靠性的工业自动化设备、高频电路及供电系统中。
- 通信系统: 在各种通信设备中，以增强信号处理及电源调节的能力。
总结
T520D337M006ATE025 是一款功能强大且应用广泛的钽电容，凭借其优异的规格和性能，成为众多高要求电子元件中的佼佼者。无论是在消费电子还是工业应用中，KEMET 钽电容都能够提供出色的解决方案，以满足现代电子设备对性能、可靠性以及长寿命的高标准期望。此款电容的设计考虑了多种使用环境，能够为整个电子设备的长效运行和稳定性保驾护航。由于其出色的电气特性与耐用性，T520D337M006ATE025 是每个工程师在选用电子元件时的理想选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
