WMSIC Electronic Components

KEMET T521D227M016ATE050

ModelT521D227M016ATE050
Package2917
BrandKEMET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
KEMET T521D227M016ATE050
Type
KEMET
Unit
Electronic Component
Minimum package
500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
KEMET
Electronic Component
T521D227M016ATE050
Electronic Component
1
Electronic Component
220uF
Package
2917
Electronic Component
Capacitor
Electronic Component
±20%
Electronic Component
8.18g
Electronic Component
1
Electronic Component
BM0264757969
Operating Temperature
55℃~+125℃
Voltage
16V
Electronic Component
Electronic Component
Electronic Component
500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

KEMET KOCAP 钽聚合物电容 T521D227M016ATE050 产品概述

一、概述

T521D227M016ATE050 属于 KEMET KOCAP 钽聚合物系列,标称容量 220 µF,公差 ±20%,额定电压 16 V。该系列以低等效串联电阻(ESR)、宽温度范围和较高的可靠性著称,适用于需要高去耦与能量缓冲的电源和电路板应用。封装尺寸为 2917(7343 公制),适配大多数表面贴装工艺。

二、主要参数(摘要)

  • 容值:220 µF
  • 精度:±20%
  • 额定电压:16 V
  • 等效串联电阻(ESR):50 mΩ @ 100 kHz
  • 工作温度:-55 ℃ ~ +125 ℃
  • 封装:2917(7343 公制)
  • 品牌:KEMET(KOCAP 钽聚合物)

三、性能与优势

  • 低 ESR:50 mΩ(100 kHz)提供优秀的瞬态响应与纹波抑制,降低电源损耗与发热。
  • 宽温度范围:-55 ℃ 至 +125 ℃,适用于工业、通信及部分车规类环境。
  • 高可靠性:钽聚合物材料在过流或异常情况下比传统液态电解表现出更可控的失效模式(更趋向开路)。
  • 高能量密度与小型封装:2917 封装在保证容量的同时节省 PCB 面积,利于高密度设计。

四、典型应用

  • DC-DC 转换器输出侧滤波与去耦
  • 高性能微处理器/FPGA 的电源去耦与瞬态供电
  • 通信设备、基站与网络设备的电源模块
  • 工业控制与仪器仪表的稳压/滤波环节

五、设计与可靠性建议

  • 极性注意:钽电容为极性器件,焊装时确保正负极方向正确,避免反向电压。
  • 电压降额:为提高长期可靠性,建议在重要系统中对额定电压进行适当降额(常见为 50%~80%,视系统要求而定)。
  • 焊接与回流:遵循 KEMET 推荐的焊接曲线及最大回流温度,避免超温或长时间高温暴露。
  • 贮存与处理:避免潮湿与机械应力,建议按厂家包装与防潮要求运输与存放。
  • 测试建议:在最终应用中进行纹波电流、温度循环与寿命验证测试,以确认在目标工况下的性能稳定性。

六、选型与采购须知

在选型时应结合实际工作频率、纹波电流、温升与空间限制进行综合评估。如需更低 ESR、更高温度等级或车规级认证,可咨询 KEMET 或经销商以获得更适配的型号与技术资料(包括封装布局、焊接建议与可靠性数据)。

总结:T521D227M016ATE050 以其 220 µF 的容量、低 ESR 与宽温度特性,适合对电源质量与瞬态响应有较高要求的中高端电子系统,是稳健的去耦与储能解决方案。若需数据手册或测试曲线,可联系供应商获取详细规格与工程支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.