Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
KEMET C0402C102K5RAC7867 是一款高性能的片式多层陶瓷电容器(MLCC),采用表面贴装技术(SMD),广泛应用于现代电子设备中。这款电容器的主要特点包括其适中的电容值、宽广的工作温度范围及优秀的电气性能,为设计师提供了灵活的应用选择。
电容值与容差: C0402C102K5RAC7867 的电容值为1000 pF,配合 ±10% 的容差,使其在消噪与信号滤波方面具备良好的精准度,适合各种高频应用。
额定电压: 该电容器的额定电压为50V,对于电气环境较为严苛的应用场景如电源去耦、旁路电容等,能够确保足够的安全余度。
宽温工作范围: 其工作温度范围从 -55℃ 到 125℃,使其适用于极端温度环境。这一特性对于航空、汽车及工业控制等领域尤为重要。
贴装设计: 0402 封装的设计不仅尺寸小巧,降低了整体电路的占用空间,还便于高密度的表面贴装,从而实现更灵活的电路布局。
优良的温度稳定性: 该电容采用了X7R温度系数材料,具有优良的温度稳定性和低失真的特性,适合在宽广温度变化下使用。
KEMET C0402C102K5RAC7867 主要应用于多个电子领域:
KEMET C0402C102K5RAC7867 是一款技术成熟且应用广泛的SMD贴片电容器,凭借其优异的性能和灵活的适用性,满足了各种电子产品的设计需求。无论是在高频滤波、旁路电路还是电源去耦方面,该电容器都能提供出色的解决方案,是电子设计师值得信赖的元件选择。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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