Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
C0603C104Z3VAC7867是由知名电子元件制造商KEMET(基美)生产的一款表面贴装陶瓷电容器,属于SMD Comm Y5V系列,具有优良的电气性能和可靠性。该电容在电子电路中广泛应用,适用于各种通用的电子设备和模块。其小巧的0603封装设计,使其成为现代电子产品设计中的重要选择。
C0603C104Z3VAC7867以其小型化的0603封装,适合现代电子产品对空间的严格要求。其工作电压为25V,确保了在各种电路条件下的稳定性。电容值为0.1 µF的设计使其在滤波、旁路和去耦等应用中表现优异,非常适合用于高频和低频电路中。
该电容的Y5V温度系数特性适用于需要较宽温度范围的应用,但使用时需注意其较大的电容容差(-20%至+80%),因此在设计过程中需谨慎考虑。C0603C104Z3VAC7867的低ESR(等效串联电阻)和高频特性,使其成为数字设备、RF电路和其他需要优良电源稳定性的应用中的理想选择。
C0603C104Z3VAC7867具有以下性能特点:
C0603C104Z3VAC7867是一款高性能的表面贴装多层陶瓷电容器,显示出KEMET(基美)在电容器领域的技术优越性。无论是在消费类电子产品、工业控制还是通信设备中,其均能满足高效能和可靠性的需求。凭借其小型化设计以及良好的电气特性,C0603C104Z3VAC7867将是许多电子设计师的优选方案。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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