WMSIC Electronic Components

KEMET T520D337M006ATE018

ModelT520D337M006ATE018
PackageCASE-D-7343-31(mm)
BrandKEMET
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 21+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
KEMET T520D337M006ATE018
Type
KEMET
Minimum package
500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
KEMET
Electronic Component
T520D337M006ATE018
Electronic Component
1
Electronic Component
330uF
Package
CASE-D-7343-31(mm)
Electronic Component
Capacitor
Electronic Component
±20%
Electronic Component
0.418g
Electronic Component
1
Electronic Component
BM0000034920
Operating Temperature
55℃~+105℃
Voltage
6.3V
Electronic Component
Electronic Component
Electronic Component
500
Resistor(ESR)
18mΩ@100kHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:T520D337M006ATE018

产品名称: T520D337M006ATE018

品牌: KEMET (基美)

类型: 钽电容(Tantalum Capacitor)

封装: SMD/SMT(表面贴装型)

产品规格:

  • 电容值: 330µF
  • 额定电压: 6.3V
  • 容差: ±20%
  • 等效串联电阻 (ESR): 18毫欧 @ 100kHz
  • 使用寿命 (在105°C 下): 2000小时
  • 工作温度范围: -55°C ~ 105°C
  • 尺寸: 0.287" 长 x 0.169" 宽 x 0.122" 高(7.30mm x 4.30mm x 3.10mm)
  • 制造商尺寸代码: D
  • 特性: 通用

应用场景:

T520D337M006ATE018 钽电容是一种高性能的电容器,广泛应用于各种电子设备和电路设计中。由于其高电容密度和稳定的电气性能,适合于电子设备中的滤波、耦合、去耦和能量储存应用。

常见应用包括:
  • 消费电子产品: 包括智能手机、平板电脑和音频设备。
  • 工业设备: 用于电源模块、传感器和仪器。
  • 通信设备: 在基站和网络终端中广泛使用。
  • 汽车电子: 包括电源管理和信号处理电路。

产品特点:

  1. 高电容密度: T520系列钽电容具有较高的电容值,能够在较小的尺寸内提供更强的能量储存能力,满足现代电子产品对空间和效能的双重需求。

  2. 宽泛的工作温度范围: -55°C到105°C的工作温度范围使得T520D337M006ATE018能够适应极端环境条件,确保其在各种操作环境中稳定运行。

  3. 优秀的ESR性能: 18毫欧的ESR值使该电容在高频应用中具有良好的性能,尤其是在切换电源和高频滤波器中,能够有效地降低功耗和热量产生。

  4. 良好的可靠性: 该电容在105°C时的使用寿命高达2000小时,这意味着在高温环境下其性能的稳定性得到保证。此外,钽电容的基本特性使其耐用性和长期可靠性优于其他类型电容。

  5. 合适的容差: ±20%的容差能够满足大多数电路对电容值的要求,同时在某些特定应用中,仍可保持较好的电气特性。

安装指南:

由于T520D337M006ATE018采用了表面贴装技术,建议根据制造商的规范进行正确的PCB布局设计,以确保良好的焊接质量和电气性能。在安装和焊接过程中要注意避免过热,以降低对电容性能的负面影响。

总结:

T520D337M006ATE018 是一款高效能和高可靠性的钽电容,适合广泛的电子应用,其优越的性能参数使其成为许多设计工程师和制造商的首选。无论是对电路的稳定性还是对空间的优化,这款产品都能有效满足需求,是现代电子设备中不可或缺的关键元件。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.