Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
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基本信息
C0603C182J5RACTU 是一款高性能的多层陶瓷电容器(MLCC),其具有优异的电气特性和可靠性,适用于各种电子设备中的去耦和旁通应用。这款电容器由知名品牌 KEMET(基美)制造,采用标准0603(1608公制)封装,适合表面贴装(SMD)技术,使其在现代电子产品中得到了广泛应用。
主要参数
温度系数:X7R
X7R材料的电容器拥有较低的温度变化,适合在-55°C至125°C的工作环境中使用,能够维持稳定的电容值,特别适用于温度波动较大的应用场合。
容量和电压等级:
电容值为1800pF(1.8nF),电压额定值为50V,这使得它能够满足对小型电容的需求,同时适应高电压电子设备的要求。其容量适合用于RF应用和滤波电路,能够有效地处理高频信号。
容差:±5%
具有±5%的电容容差,提供了相对较高的精确度,适用于需要精密电容的电路设计。
尺寸:0.063" x 0.031"(1.60mm x 0.80mm),厚度为0.034"(0.87mm)
小型化的设计使C0603C182J5RACTU非常适合集成在空间受限的电路板上。当今许多消费类电子产品趋向小型化,该电容器的微型封装能够满足这些需求。
应用场景
C0603C182J5RACTU 适合多种应用,包括但不限于:
可靠性和寿命
KEMET品牌的产品以其可靠性而闻名,C0603C182J5RACTU采用的多层陶瓷材料能承受长时间的使用,并在极端条件下保持性能,适应苛刻的工作环境。
结论
C0603C182J5RACTU是一款性能卓越且广泛适用的电容器,适合现代电子设计中的多种需求。在快速发展的电子行业中,它的小型化和高性能特性使其成为设计工程师的理想选择,帮助构建更小、更高效的电路系统。无论是在消费电子、工业设备还是高端通信设备中,这款电容器都可以发挥重要作用,确保电路的稳定性和可靠性。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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