WMSIC Electronic Components

NCE NCE6075K

ModelNCE6075K
PackageTO-252-2(DPAK)
BrandNCE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 22+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
NCE NCE6075K
Type
NCE
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
NCE
Electronic Component
NCE6075K
Electronic Component
1
Package
TO-252-2(DPAK)
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.547g
Electronic Component
1
Electronic Component
BM0257689233
Operating Temperature
55℃~+175℃
Power Dissipation(Pd)
110W
Electronic Component
Electronic Component
Electronic Component
2500
Voltage(Vdss)
60V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

NCE6075K 产品概述

一、产品简介

NCE6075K 是新洁能(NCE)推出的一款中压大电流 N 沟道功率 MOSFET,封装为 TO-252(DPAK),面向开关电源、同步整流、功率开关和电机驱动等需要 60V 耐压与较大导通电流的场景设计。器件在 10V 闸极驱动下具有较低的导通电阻,适用于对导通损耗与散热有一定要求的电源及功率电路。

二、主要参数(关键规格)

  • 类型:N 沟道功率 MOSFET
  • 品牌/型号:NCE(新洁能) / NCE6075K
  • 漏源电压 Vdss:60 V
  • 连续漏极电流 Id:75 A
  • 导通电阻 RDS(on):11.5 mΩ @ Vgs=10 V, Id=30 A
  • 耗散功率 Pd:110 W
  • 栅极阈值电压 Vgs(th):4 V @ Id=250 µA
  • 总栅电荷 Qg:50 nC @ Vgs=10 V
  • 工作温度范围:-55 ℃ ~ +175 ℃
  • 封装:TO-252-2 (DPAK)

三、特性亮点

  • 低导通电阻:在 10 V 栅压下 RDS(on) 为 11.5 mΩ,可显著降低导通损耗,适合大电流低压降场合。
  • 高额定电流:75 A 的连续漏极电流使其在中小功率到中高功率应用中具有良好能力。
  • 中等耐压等级:60 V 的耐压适合常见的汽车电子(部分域)、工业电源和通用 DC-DC 转换器。
  • 中等栅电荷:Qg=50 nC,切换期间栅极驱动能耗和开关损耗处于可控范围;需配合合适的驱动器与阻尼手段以控制开关过冲和 EMI。
  • 宽工作温度:可工作至 175 ℃,适应要求较高的环境温度,但需注意封装和 PCB 散热设计。

四、典型应用场景

  • 同步整流与降压转换器(buck converters)
  • 负载开关、直流断路与功率分配模块
  • 电机驱动前级(作为功率开关)
  • 汽车电子低压域电源(需确认整体系统耐压与温度)
  • UPS/电源管理、电池保护与充放电控制

五、设计与使用建议

  • 栅极驱动:为了保证标称 RDS(on),建议使用接近 10 V 的栅极驱动电压;若仅使用 5 V 驱动,导通电阻会显著增加,应评估损耗与温升。
  • 开关速度控制:Qg=50 nC 表明在高频切换时栅极能耗不可忽视,推荐使用专用门极驱动器并结合 5–20 Ω 的门极电阻以抑制振铃和 EMI。
  • 保护措施:对感性负载建议并联续流二极管或采用合适的续流路径;在存在过压或反向能量时,考虑 TVS 或吸收网络保护。
  • 热设计:TO-252 为表面贴装散热依赖 PCB 铜箔与焊盘,建议大面积散热铜箔、适当过孔或散热板以降低 RθJA,避免长期在额定 Pd 下工作而导致过热老化。
  • PCB 布局:电源走线尽量短宽,源、漏与栅走线分离以减少寄生电感;输入/输出电容靠近器件以降低回路电感。

六、封装与热管理提示

TO-252(DPAK) 适合贴片生产并可实现较好的焊接可靠性,但单纯基于封装的散热能力有限。实际应用中应通过增加铜面积、连接底部散热焊盘并采用多层板内层散热层或热过孔来提升散热能力。器件的 110 W 热耗散指标通常是在理想条件(良好散热)下测得,实际设计需依据 PCB 热阻与系统散热条件进行功率与温升换算并留有裕量。

七、选型与可靠性建议

NCE6075K 在 60 V/75 A 等级中提供了较低的导通损耗与合理的开关特性,适合多数中功率开关电源与功率管理场合。选型时应确认:

  • 系统栅极驱动电压与频率匹配(以控制开关损耗);
  • PCB 散热能力足以承担预计连续功率;
  • 在高温或恶劣环境下,器件的长期可靠性评估(如温升、热循环与焊接工艺)满足产品寿命要求。

总结:NCE6075K 是一款面向工业与消费类电源应用的中压大电流 MOSFET,结合恰当的栅驱与散热设计,可以在多种开关与功率控制场景中提供高效稳定的性能。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.