Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
NISSHINBO RP114K121D-TRB
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- NISSHINBO RP114K121D-TRB
- Type
- DFN1010-4B
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- NISSHINBO
- Electronic Component
- 75uVrms
- Electronic Component
- RP114K121D-TRB
- Electronic Component
- 1
- Package
- DFN1010-4B
- Electronic Component
- Linear Regulator(LDO)
- Electronic Component
- 0.01g
- Electronic Component
- 1
- Electronic Component
- BM0230885932
- Operating Temperature
- 40℃~+85℃@(Ta)
- Operating Voltage
- 5.25V
- Output
- Electronic Component
- Output Voltage
- 1.2V
- Output Current
- 300mA
- Output Type
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RP114K121D-TRB 产品概述
一、产品简介
RP114K121D-TRB 是 NISSHINBO 提供的一款固定输出线性稳压器（LDO），输出电压为 1.2V，面向对低噪声、高抑制比和可靠保护要求的电源场景设计。器件采用小型 DFN1010-4B 封装，单通道输出，适合空间受限的便携与嵌入式设备。
二、主要特性
- 固定输出：1.2V 正极输出
- 最大输出电流：300mA
- 工作电压（最高）：5.25V（输入端）
- PSRR：75dB @ 1kHz，抑制输入纹波能力强
- 输出噪声：75 μVrms（低噪声）
- 保护功能：过流保护（OCP）
- 控制：带使能（EN）引脚，可实现输出开/关控制（具体阈值请参照数据手册）
- 工作温度范围：-40℃ ~ +85℃（Ta）
三、电气性能与优势
高达 75dB 的 PSRR 在中低频段能有效抑制电源噪声，配合 75 μVrms 的低输出噪声，使本器件非常适合为模数混合前端、通信射频前端或低噪声基准供电。过流保护能在瞬态故障或短路时限制电流，提升系统可靠性。使能功能便于系统进行电源管理与功耗控制。
四、封装与热管理
DFN1010-4B 小体积封装利于高密度 PCB 布局，但热阻相对较高。注意功耗评估：在 Vin=5.25V、Vout=1.2V、Iout=300mA 情况下，器件耗散功率约为 1.215W，应通过合理的 PCB 散热（底层大铜箔、过孔、地平面）和宽导线来降低结温，确保在高温工况下稳定工作。
五、典型应用
- SoC/FPGA/MCU 核心电源（1.2V 核心域）
- ADC/DAC、时钟和低噪声模拟前端供电
- 便携式与消费类电子的局部稳压
- 通信设备及射频模块的模拟供电
六、使用建议与 PCB 布局要点
- 输入侧建议放置 1 μF 以上去耦电容，靠近 VIN 引脚；输出侧采用 2.2 μF～10 μF 低 ESR 陶瓷电容（X5R/X7R）以保证稳态与瞬态响应。
- EN 引脚请按数据手册逻辑电平连接，若不使用建议拉高或拉低至规定电平以避免未定义状态。
- PCB 布局尽量缩短输入/输出回流路径，输出电容靠近 VOUT 引脚放置，器件下方和邻近区域保留充足铜面积形成散热区。
- 考虑到热散与长时间可靠性，建议在接近最大功耗工况下进行热仿真或实测验证。
如需更详细的引脚定义、典型应用电路与温度特性曲线，请参照厂家完整数据手册或联系 NISSHINBO 授权渠道获取技术支持。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
