Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ML51FB9AE 是新唐(NUVOTON)基于 51 内核的低功耗 8 位单片机,适合对成本、功耗和可靠性有严格要求的小型嵌入式应用。器件内置 16KB FLASH 程序存储器与 1KB 系统 RAM,可在 1.8V 到 5.5V 宽电压范围内工作,环境温度范围为 -40℃ 至 +105℃,封装为 20‑TSSOP。
该芯片采用 51 系列内核,最高主频 24MHz,8 位位宽设计适合控制类、计时类和简单数据处理任务。16KB 的 FLASH 提供了足够的代码空间用于大多数家电、工业传感和便携式设备功能实现;1KB RAM 可满足堆栈与运行时数据存储需求。器件强调低功耗特性,适用于电池供电或功耗敏感的场景。
ML51FB9AE 提供多达 16 路通用 I/O,可用于控制、采集和外设接口。片内集成 12‑bit ADC,可实现较高分辨率的模拟信号采样,满足传感器读数和模拟量控制要求。内置振荡器简化系统设计,常规情况下无需外部晶振即可运行,减少 BOM 和成本。
工作电压:1.8V ~ 5.5V,适配单节至多节电池以及多种电源域。工作温度:-40℃ ~ +105℃,适应工业级环境。封装为 20‑TSSOP,体积小巧,便于 PCB 密度控制与中小批量生产。I/O 数量与封装管脚分配需在使用前参考器件管脚图以合理布局。
总结:ML51FB9AE 以 51 内核的成熟架构、16KB FLASH 和 12‑bit ADC 等特性,为中小规模控制与采集应用提供了一款稳定、低功耗且成本友好的选择。有关引脚分配、电气特性曲线与典型应用电路,请参阅新唐官方数据手册以获取详细信息。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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