WMSIC Electronic Components

ON MMBT3906LT1G

ON MMBT3906LT1G
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Product image

ModelMMBT3906LT1G
PackageSOT-23
BrandON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

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Technical data

Product details

20 specifications

Core information

Product name
ON MMBT3906LT1G
Type
ON
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ON
Electronic Component
MMBT3906LT1G
Electronic Component
1
Package
SOT-23
Electronic Component
1 PNP
Electronic Component
Transistor(BJT)
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM0000285250
Operating Temperature
55℃~+150℃
Transistor Type
PNP
Frequency(f T)
250MHz
Power Dissipation(Pd)
225mW
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MMBT3906LT1G 产品概述

产品基本信息

MMBT3906LT1G 是一款由安森美（ON Semiconductor）生产的PNP型双极晶体管（BJT），专为低功耗、高频率应用设计。该器件采用 SOT-23-3（TO-236）封装，适合表面贴装（SMD），在电子设备中具有广泛的应用。

关键规格

这款晶体管的额定功率为300mW，最大集电极电流为200mA，集射极击穿电压（Vce）为40V。其在不同的集电极电流（Ic）和基极电流（Ib）条件下，具有最大饱和压降为400mV @ 5mA和50mA，确保在工作时能够实现较低的功耗和良好的效率。同时，该产品具备最低的直流电流增益（hFE）为100，测试条件为10mA集电极电流和1V电压，这意味着在常规工作情况下能有效放大输入信号。

工作温度范围

MMBT3906LT1G 的工作温度范围为-55°C到150°C，这使得它适合在各类严苛环境下运行，尤其适用航空航天、汽车及工业控制等领域。这种宽广的温度范围确保了该器件在极端条件下的可靠性与持久性。

高频性能

该器件的频率跃迁（Transition Frequency）达到 250MHz，表明它适合用于各种高频应用，包括射频放大器和信号处理电路，从而满足现代电子产品对处理速度的高要求。

封装与安装

MMBT3906LT1G采用紧凑的SOT-23-3（TO-236）封装，使其在电路设计中具有较高的空间效率。该表面贴装型设计能够使得在电路板上的安装更加便捷，有效减少了组装时间与成本，同时提高了整体电路设计的可密度。

应用领域

由于其出色的性能，MMBT3906LT1G 可以广泛应用于多种领域，包括：

  1. 音频放大器：适用于音频放大及信号处理，提供优质音频输出。
  2. 开关电路：可以用于低功耗开关应用，提供稳定的开关性能。
  3. 放大器电路：可广泛应用在信号放大及处理电路中，确保信号的质量和稳定性。
  4. 射频应用：由于其高频特性，适合射频信号放大及相关应用。

产品优势

  • 高性能：结合了高电流增益和低饱和电压特点，为各种应用提供更高的效率。
  • 广泛的温度适应性：保证在各种极端温度下均可工作，增加了可靠性。
  • 紧凑的封装：提升了产品的兼容性和密度，适合现代电子设备中空间的追求。

在现代电子设计与应用中，高效、可靠的元器件是确保整个系统稳定性的重要因素。MMBT3906LT1G凭借其卓越的性能和灵活的应用场景，成为诸多电子设计师和工程师的首选。随着科技的不断进步，对于这种高性能、低功耗器件的需求将持续增长，MMBT3906LT1G能够满足市场的多元化需求，并在未来的设计中发挥更大的作用。

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