Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BAT54XV2T1G 是一款高性能的肖特基二极管,由知名电子器件制造商安森美(ON Semiconductor)生产。凭借其卓越的电气特性和广泛的工作温度范围,这款器件被广泛应用于各种电子设备和系统中,如电源管理、信号整流、保护电路及高频应用等。
肖特基二极管特性 BAT54XV2T1G采用了肖特基二极管的设计理念,相较于传统二极管,肖特基二极管具有更低的正向电压降和更快的切换速度。具体来说,该产品在100mA的条件下,其正向电压(Vf)仅为800mV,能够有效降低功耗并提升可靠性。
电流与反向电压 此器件的平均整流电流(Io)为200mA(DC),最大反向电压(Vr)可达到30V。这使得BAT54XV2T1G非常适合于需要较高整流效率和稳定性的电路应用,同时其反向电流(2µA @ 25V)在保证元件正常运作的情况下,进一步减少了电路的能量损耗。
开关速度与反向恢复时间 BAT54XV2T1G的小信号速度设计相应于≤200mA(Io),其反向恢复时间(trr)仅为5ns。这意味着该器件能够在高频应用中维持优异的性能表现,适合用于需要快速切换的电源设计。
电容特性 该器件的电容在不同的反向电压(Vr)和频率(F)下,其电容值为10pF(@1V,1MHz),这使得它在高频应用中能保持较低的寄生电容,有助于提升电路的整体性能。
温度范围 BAT54XV2T1G的工作结温范围为-55°C至125°C,使其在各种严苛环境中依然保持出色的性能。这种宽温度范围使得该器件成为高温和低温应用的理想选择,能够在汽车电子、工业控制及消费电子等领域中得到广泛应用。
封装与安装 该器件采用SOD-523封装,表面贴装类型设计对于现代电子产品的发展趋势极为适合。SOD-523封装不仅可以节省面积,还能够提高装配效率。同时,良好的散热性能使得其在高负荷工作下依然保持稳定性。
BAT54XV2T1G广泛应用于以下领域:
总体来说,BAT54XV2T1G是一款涵盖多种应用需求的优质肖特基二极管,具备低正向电压、快速切换速度和宽温度范围的优秀特性,非常适合于现代电子设备的设计需求。作为ON Semiconductor的产品,BAT54XV2T1G将为工程师和设计师提供可靠的解决方案,助力高效、高稳定性的电子系统开发。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products