WMSIC Electronic Components

ON RB521S30T1G

ModelRB521S30T1G
PackageSOD-523
BrandON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ON RB521S30T1G
Type
ON
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ON
Electronic Component
RB521S30T1G
Electronic Component
1
Package
SOD-523
Electronic Component
Schottky Diode
Electronic Component
0.024g
Electronic Component
1
Electronic Component
BM0093065400
Current
200mA
Diode
1
Current(Ir)
30uA@10V
(Vf)
500mV@200mA
Electronic Component
55℃~+125℃
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RB521S30T1G 产品概述

产品概述

RB521S30T1G 是一款优质的肖特基二极管,采用表面贴装型封装(SOD-523),广泛应用于各种电子电路中,尤其是在需要快速开关和低正向电压降的场合。这款二极管具有良好的性能特征,适用于小信号处理、逆向保护、电源管理和其他多种应用。

基本参数

  • 安装类型:表面贴装型(SMD)
  • 二极管类型:肖特基
  • 电流 - 平均整流 (Io):200mA(DC)
  • 不同 If 时电压 - 正向 (Vf):500mV @ 200mA
  • 电压 - DC 反向 (Vr)(最大值):30V
  • 不同 Vr 时电流 - 反向泄漏:30µA @ 10V
  • 工作温度 - 结:-55°C ~ 125°C
  • 封装/外壳:SOD-523,SC-79

性能优势

  1. 低正向电压降:RB521S30T1G 在 200mA 的工作电流下,正向电压降仅为 500mV,意味着在传导时的功耗极低,非常适合用于低电压和高效率的电源设计。

  2. 高电流承载能力:该二极管能够承受高达 200mA 的持续直流电流,使其在大多数小信号应用中表现出色。

  3. 较高的反向电压能力:RB521S30T1G 的最大反向电压为 30V,能够满足大多数应用对电压的需求,确保在反向偏置条件下能够安全工作。

  4. 低反向漏电流:其反向泄漏电流仅为 30µA(@ 10V),在保证性能的同时,进一步降低了功耗。

  5. 广泛的工作温度范围:适用于极端的工作环境,RB521S30T1G 的结温范围从 -55°C 到 125°C,确保二极管在恶劣条件下仍能稳定工作。

应用场景

RB521S30T1G 二极管的优良特性使其在诸多应用中脱颖而出,包括但不限于:

  • 电源管理:用于开关电源、DC-DC 转换器中,提供快速恢复时间和低損耗。
  • 逆向保护:在电流方向错误接入时,可以有效保护电路不受损坏。
  • 小信号整流:适合于RF应用或低功耗数字电路,有助于维持信号完整性和健康。
  • LED驱动:在LED驱动电路中,可以有效提高效率,降低对功率要求。
  • 电池供电设备:在移动设备或便携式产品中,利用其低功耗特性提高电池寿命。

封装与兼容性

RB521S30T1G 采用 SOD-523 封装,具备小巧的体积和轻量化的特点,从而适合于现代高密度电路设计。这种封装不仅降低了热阻,还促进了热量的有效散发,进一步提高二极管的可靠性和性能。

结论

综合以上特性,RB521S30T1G 是一款高性能肖特基二极管,凭借其低电压降、高电流承载能力以及广泛的工作温度范围,成为众多电气工程师和设计师的首选元件。无论是在电源管理、逆向保护,还是其他众多应用场合,RB521S30T1G 都能充分满足现代电子产品对性能和可靠性的高要求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.