Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ON MMBTA06LT1G
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- ON MMBTA06LT1G
- Type
- ON
- Unit
- Electronic Component
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- ON
- Electronic Component
- MMBTA06LT1G
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 NPN
- Electronic Component
- Transistor(BJT)
- Electronic Component
- 0.03g
- Electronic Component
- 1
- Electronic Component
- BM0000001509
- Operating Temperature
- 55℃~+150℃
- Transistor Type
- NPN
- Frequency(f T)
- 100MHz
- Power Dissipation(Pd)
- 225mW
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MMBTA06LT1G 产品概述
概述
MMBTA06LT1G是一款高性能的NPN型晶体管，采用SOT-23-3表面贴装封装，广泛应用于电子电路中，具备良好的增益特性和较低的饱和压降。该晶体管特别适合于要求高频率和高效率的电路应用，如开关电源、信号放大以及开关电路等。
主要特点
电流特性：
- 最大集电极电流 (Ic): 500mA，使其适用于高负载条件，尤其在需要较大电流驱动的场合。
- 集电极截止电流 (Ic(max)): 100nA，表明其具有优秀的关闭状态特性，可以有效降低功耗，适合用于低功耗应用。
电压特性：
- 集射极击穿电压 (Vce(max)): 80V，确保在高电压环境中能够稳定工作，适合电源管理和功率驱动应用。
增益特性：
- 直流电流增益 (hFE): 最低100 @ 100mA, 1V，突显其在小信号放大中的卓越表现，使其在高频放大应用中非常有效。
饱和压降：
- Vce饱和压降: 最大250mV @ 10mA，100mA，显示出该晶体管在开启状态时可获得较低的电压损失，从而提高整体电路效率。
工作温度范围：
- 温度范围: -55°C ~ 150°C，适应广泛的环境条件，适合于航空航天、工业控制以及汽车电子等高要求的应用场合。
频率特性：
- 跃迁频率: 100MHz，表明其在高频应用中的可用性，能够支持快速信号处理和转换。
功率规格：
- 最大功率: 225mW，适合于多种中低功耗应用，为电路设计提供灵活性。
应用领域
MMBTA06LT1G的多种特性使其能够在多个领域得到广泛应用，其中包括但不限于：
- 信号放大：在低频和高频放大应用中，凭借其较高的增益使其能够高效放大输入信号。
- 开关电路：适合用于开关电源、LED驱动及其它需要开关操作的电路。
- 音频设备：在音频放大器和设备中，其可靠的性能可以确保高质量的音频输出。
- 仪器仪表：在各种测量和显示设备中，可用于信号的处理和放大。
封装和接口
MMBTA06LT1G采用SOT-23-3封装，适合表面贴装技术(SMT)，能够减少PCB占用空间并提高整个电路的集成度。小尺寸使其在现代小型电子产品中更具优势，满足现代电子设计对尺寸和功率的需求。
结论
综上所述，MMBTA06LT1G是一款功能强大、应用广泛的NPN晶体管。其良好的电流增益、低饱和压降和宽广的工作温度范围使其成为各种电子设备中不可或缺的元件。ON（安森美）作为一个享有盛誉的品牌，其产品始终坚持高质量和高性能的原则，使得MMBTA06LT1G在市场中具备强大的竞争力。在选择适合您项目的晶体管时，MMBTA06LT1G无疑是一个值得考虑的优质选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
