WMSIC Electronic Components

ON MMBT5551LT1G

ModelMMBT5551LT1G
PackageSOT-23
BrandON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ON MMBT5551LT1G
Type
ON
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ON
Electronic Component
MMBT5551LT1G
Electronic Component
1
Package
SOT-23
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM0000001921
Operating Temperature
55℃~+150℃
Transistor Type
NPN
Power Dissipation(Pd)
300mW
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MMBT5551LT1G 产品概述

一、产品简介

MMBT5551LT1G是一款来自ON(安森美)的高性能NPN型双极晶体管(BJT),专为各种电子应用而设计。该器件采用SOT-23-3(TO-236)封装,既便于表面贴装,又有效节省了印刷电路板的空间。凭借其强大的电流处理能力和工作温度范围,MMBT5551LT1G在现代电子设备中被广泛应用,特别是在信号放大和开关电路中。

二、主要参数

  1. 电流特性

    • 最大集电极电流(Ic):600mA,适合中等功率的应用场景,确保在负载变化时依然能保持稳定。
    • 不同基极电流(Ib)、集电极电流(Ic)时的饱和压降(Vce):在5mA和50mA时最大值为200mV,显示出良好的开关性能,适合高速开关应用。
  2. 电压和功率

    • 最大集射极击穿电压(Vceo):160V,提供了良好的电气隔离,确保器件在高电压环境下的安全性。
    • 最大功率额定值:225mW,适应多种功率要求的电路设计。
  3. 热性能

    • 工作温度范围广,从-55°C到150°C,使其适合在严苛环境下操作,确保高可靠性和长期稳定性。
  4. 电流增益

    • 在不同集电极电流(Ic)和集射极电压(Vce)条件下,DC电流增益(hFE)最小为80 @ 10mA,5V,这一点在设计中对于信号放大具有重要意义。

三、应用领域

由于其优异的性能,MMBT5551LT1G被广泛应用于以下领域:

  • 消费电子:如音频放大器、电视机、音响设备等。
  • 工业控制:在传感器及控制电路中,用作信号放大和开关。
  • 通信设备:广泛应用于信号处理电路,提升信号传输的质量。
  • 电源管理:在开关电源和线性稳压器中,用于控制和调节电流,确保稳定的输出电压。

四、优势与特点

  • 高集电极电流:支持600mA的集电极电流,适合多种功率要求的应用。
  • 低饱和压降:在5mA和50mA操作时最大200mV的饱和压降,提升了器件的开关效率,适合高频应用。
  • 高增益特性:DC电流增益hFE的性能保证了有效的信号处理能力。
  • 广泛的工作环境适应性:从-55°C至150°C的工作温度范围,使该器件在恶劣环境条件下表现优异,适合军用、航空等高要求应用。
  • 表面贴装技术兼容性:SOT-23封装可支持高密度的PCB设计,满足现代电子设备对小型化的需求。

五、总结

整体而言,MMBT5551LT1G是一款功能强大且灵活的NPN型三极管,其优异的电气性能与宽广的应用范围使其成为一款非常理想的选择。无论是在消费电子、工业控制还是通信设备中,该器件均能充分发挥其性能优势,为电子产品提供可靠、高效的解决方案。考虑到其性能和广泛的适用性,MMBT5551LT1G无疑是众多设计工程师在电子产品开发过程中的优选部件。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.