WMSIC Electronic Components

ON 1N5231BTR

Model1N5231BTR
PackageDO-35
BrandON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ON 1N5231BTR
Type
ON
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ON
Electronic Component
1N5231BTR
Electronic Component
1
Package
DO-35
Electronic Component
Zener Diode
Electronic Component
0.12g
Electronic Component
1
(Zzk)
1.6kΩ
(Zzt)
17Ω
Electronic Component
BM0230804707
Diode
1
Current(Ir)
5uA@2V
Power Dissipation(Pd)
500mW
Electronic Component
4.845V~5.355V
Electronic Component
65℃~+200℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1N5231BTR齐纳二极管产品概述

一、产品基本识别信息

1N5231BTR是安森美(ON Semiconductor)推出的小功率齐纳稳压二极管,核心功能为提供稳定的5.1V基准电压。该器件采用DO-35轴向通孔封装,适配传统PCB通孔焊接工艺,是电子电路中通用的稳压、基准及过压保护元件,广泛应用于各类低/中功率场景。

二、核心电性能参数解析

该器件的电性能参数经过严格校准,满足通用电路的稳压需求,关键参数如下:

  1. 稳压值特性:标称稳压值为5.1V,稳压范围覆盖4.845V~5.355V(对应±5%精度),适用于对稳压精度要求不苛刻的通用场景(如小型电源稳压、简单基准电路);
  2. 反向漏电流:在反向偏置电压2.0V时,漏电流仅为5μA,体现了良好的反向截止特性,可有效降低电路静态功耗;
  3. 最大耗散功率:额定耗散功率为500mW,即器件连续工作时允许的最大功耗,需结合电路电流控制(如串联限流电阻),避免超功率损坏;
  4. 动态阻抗:包含两个关键阻抗参数——Zzt(动态阻抗,典型测试条件下)为17Ω,Zzk(测试电压下的阻抗)为1.6kΩ。低动态阻抗(Zzt=17Ω)可保证稳压值在工作电流变化时的稳定性,减少电压波动。

三、封装与物理特性

1N5231BTR采用DO-35轴向通孔封装,这是一种成熟的小功率半导体封装形式,具备以下特点:

  • 封装尺寸紧凑(轴向引线设计),便于PCB布局,尤其适合空间受限的小型电路;
  • 通孔焊接方式兼容性强,可适配手工焊接、波峰焊等传统工艺,无需特殊贴装设备;
  • 封装材料具备基础耐温性,配合宽结温范围可满足多场景使用。

四、环境与工作适应性

该器件的工作结温范围为-65℃~+200℃,覆盖了广泛的环境温度区间:

  • 低温端可适应严寒环境(如户外工业设备、低温存储设备);
  • 高温端可承受较高结温(如功率电路附近的散热空间有限场景),无需额外复杂散热设计(需注意实际功耗不超500mW);
  • 宽温特性使其可应用于工业控制、消费电子、小型电源等领域的高低温场景。

五、典型应用场景

结合1N5231BTR的参数特性,其典型应用包括:

  1. 电源稳压电路:作为线性稳压电路的基准或后级稳压元件,为MCU、传感器等低功耗模块提供稳定的5.1V电压;
  2. 过压保护:与电阻串联后并联在敏感元件两端,当输入电压超过稳压值时导通,钳位电压至5.1V左右,保护后端电路免受过压冲击;
  3. 基准电压源:在简单ADC/DAC电路中作为参考电压,满足低精度基准需求;
  4. 电平转换:配合其他元件实现不同电压域(如3.3V与5V)之间的电平匹配,避免电压不兼容问题。

六、品牌与可靠性保障

安森美作为全球知名半导体厂商,1N5231BTR遵循严格的生产工艺与质量管控:

  • 产品符合JEDEC等行业标准,一致性好;
  • 宽结温、低漏电流等参数设计保证了长期工作的可靠性;
  • 适合工业级应用的基础要求,可降低电路故障风险。

综上,1N5231BTR是一款性价比高、通用性强的齐纳二极管,可满足多数低/中功率电路的稳压、基准及保护需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.