WMSIC Electronic Components

ON MMBT4403LT1G

ModelMMBT4403LT1G
PackageSOT-23
BrandON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ON MMBT4403LT1G
Type
ON
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ON
Electronic Component
MMBT4403LT1G
Electronic Component
1
Package
SOT-23
Electronic Component
1 PNP
Electronic Component
Transistor(BJT)
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM0000000209
Operating Temperature
55℃~+150℃
Transistor Type
PNP
Frequency(f T)
200MHz
Power Dissipation(Pd)
225mW
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MMBT4403LT1G 产品概述

产品简介

MMBT4403LT1G是一款由安森美半导体(ON Semiconductor)生产的PNP型晶体管,专为高效能和高温环境而设计,适合广泛的电子应用。该三极管在功率、速度和温度范围等方面提供了平衡的性能,常用于放大器和开关电路。其紧凑的SOT-23-3(TO-236)封装使其非常适合于空间受限的应用,如便携式设备和消费电子产品。

技术参数

MMBT4403LT1G的主要技术参数如下:

  • 晶体管类型: PNP
  • 集电极最大电流(Ic): 600mA
  • 集射极击穿电压最大值(Vceo): 40V
  • 饱和压降(Vce饱和): 在50mA和500mA时的最大值分别为750mV和500mV。
  • 直流电流增益(hFE): 在150mA和2V时,最小值为100。此增益值确保在输出小信号时能够有效驱动负载。
  • 功率最大值: 300mW,适用于低功率应用场景
  • 频率跃迁: 200MHz,适合高频开关应用
  • 工作温度范围: -55°C至150°C,确保在严苛环境条件下的稳定性能
  • 封装类型: SOT-23-3(TO-236),表面贴装设计,便于在现代电路板上集成。

应用领域

MMBT4403LT1G可广泛应用于以下领域:

  1. 开关电路:其600mA的集电极电流允许它控制比一般信号更大的负载,非常适用于继电器和小型电机的控制。

  2. 放大器电路:凭借其良好的直流电流增益,适合用于小信号放大应用,能够在多种电压环境下提供稳定增益。

  3. 便携式电子设备:较高的工作温度范围使得MMBT4403LT1G在电子设备的各类环境中表现出色,因此非常适合用于便携式音频设备、智能手机和其他小型消费产品。

  4. 电源管理:在电源调节和分配电路中,可以用作开关元件,提高转化效率。

性能优势

  1. 高耐压和高电流能力:MMBT4403LT1G在40V的电压下,能够承受高达600mA的集电极电流,为电路设计提供了很大的灵活性。

  2. 低饱和压降:其在高电流下的低饱和压降特性减少了功耗和热量产生,有助于提高电路的整体效率。

  3. 良好的温度稳定性:在恶劣环境下,MMBT4403LT1G仍然能够保持良好的性能,适合严酷的温度条件。

  4. 紧凑的封装设计:SOT-23-3封装的紧凑设计,适合现代小型设备的需求,能够有效节省PCB空间。

总结

MMBT4403LT1G是一款高性能PNP型晶体管,具备广泛的应用潜力和出色的技术参数,适应多种电子产品的设计需求。无论是低功率开关应用还是小信号放大器应用,它都能提供可靠的解决方案。结合安森美的高品质制造,MMBT4403LT1G确保其在各种严苛环境下的稳定性和长寿命,是电子设计师的理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.