Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ON ESD9B5.0ST5G
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- ON ESD9B5.0ST5G
- Type
- ON
- Unit
- Electronic Component
- Minimum package
- 8000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- ON
- Electronic Component
- ESD9B5.0ST5G
- Electronic Component
- 1
- Package
- SOD-923
- Electronic Component
- Electronic Component
- Type
- TVS
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.011g
- Electronic Component
- 1
- Channel Count
- Electronic Component
- Cj- Capacitor
- 15pF
- Electronic Component
- BM0093065337
- Operating Temperature
- 55℃~+150℃
- Voltage
- 15V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：ESD9B5.0ST5G
ESD9B5.0ST5G 是由安森美（ON Semiconductor）公司生产的一种表面贴装型二极管，专门设计用于静电放电（ESD）保护。这款齐纳二极管不仅在抗击静电放电方面表现卓越，同时还具备多种优异的电气特性，使其在各种电子应用中得到了广泛的应用。
主要特性
电容特性：ESD9B5.0ST5G 在 1MHz 的频率下表现出一个非常低的电容值，约为 15pF。这一特性使其特别适合用于高速信号线的保护，能够有效防止由于高频信号变化带来的损失或干扰。
电压参数：该器件的反向击穿电压最小值为 5.8V，并且在正常工作状态下的反向断态电压（典型值）为 5V（最大）。这一特性确保在遭受瞬态过压（如 ESD、浪涌电流等）时，设备能够保持可靠的保护，同时在正常工作条件下不会误动作。
工作温度范围：ESD9B5.0ST5G 的工作温度范围广泛，从-55°C 到 150°C（TJ），这使得该器件能够在极端温度环境下稳定工作，满足多种工业和消费类电子产品的需求。
封装类型：采用 SOD-923 的表面贴装封装，ESD9B5.0ST5G 具备小型化的优势，便于在空间有限的电路板上进行安装。表面贴装型设计还确保了其与自动化组装线的高度兼容，使生产效率大幅提升。
双向通道：该器件为双向通道设计，意味着它能够在两个方向上提供瞬态电压抑制，适用于多种不同的电路配置，增强了其应用的灵活性。
应用领域
ESD9B5.0ST5G 适用于多种电子设备的 ESD 保护，尤其在以下场合表现突出：
消费类电子：智能手机、平板电脑、笔记本电脑等便携式设备的 USB 接口和数据线保护。
工业自动化：用于各种传感器和控制器的接口保护，确保在工业环境中设备不会受到静电干扰造成的损害。
通信设备：在无线和有线通信设备中，为射频（RF）电路及数据传输线路提供有效保护，防止 ESD 在信号传输过程中的损害。
汽车电子：随着汽车电子设备的普及，ESD9B5.0ST5G 也可以用于车载电子系统中，提升车辆电子设备的可靠性和稳定性。
结论
ESD9B5.0ST5G 是一款高性能的 ESD 保护元件，凭借其出色的电压特性、宽工作温度范围及小巧的封装设计，成为众多电子设备的理想选择。安森美在该产品的设计中，充分考虑了现代电子产品对体积、效率和可靠性的高要求，使得 ESD9B5.0ST5G 在诸多应用中均能发挥出色的保护作用。无论是在消费类电子、工业自动化，还是通信和汽车电子领域，该器件都有助于确保设备的可靠性与长期稳定运行。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
