Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ON RS1M
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ON RS1M
- Type
- ON
- Minimum package
- 7500
Technical parameters
- Electronic Component
- ON
- Electronic Component
- RS1M
- Electronic Component
- 1
- Package
- SMA(DO-214AC)
- Electronic Component
- Fast Recovery / High-Efficiency Diode
- Electronic Component
- 0.108g
- Electronic Component
- 1
- Electronic Component
- BM0095945960
- Current
- 1A
- Current(Ir)
- 5uA@1kV
- (Vf)
- 1.3V@1A
- Power Dissipation(Pd)
- 1.19W
- Electronic Component
- 55℃~+150℃
- Electronic Component
- 7500
- Voltage Rating(Vr)
- 1kV
- (Trr)
- 500ns
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RS1M 产品概述
RS1M 是一款高性能的快恢复二极管，专为需要高效率及可靠性的应用而设计，广泛用于电源管理、开关电源、整流电路和各种工业控制系统中。其主要应用领域包括但不限于电动车充电器、逆变器、LED 驱动、以及其他需要高电压和快速开关能力的电路。
关键规格
二极管类型: 该产品属于标准二极管类型，具备可靠的整流特性。
额定参数:
- 最大反向电压 (Vr): 1000V，能够在高压环境下稳定工作，适合对高电压要求严格的应用场合。
- 平均整流电流 (Io): 1A，保证了在长期使用情况下的可靠性和稳定性。
- 正向电压 (Vf): 在1A的条件下，其正向电压为1.3V，具有较低的导通损耗，从而提升了整体电源效率。
速度与恢复时间:
- 快速恢复特性: 该二极管具备快速恢复特性，反向恢复时间 (trr) 为500ns，使其在高频开关应用中表现优异。
- 反向恢复电流: 在200mA的条件下，确保了电路的稳定性和有效性。
反向泄漏电流: 该二极管在1000V的条件下，反向泄漏电流仅为5µA，极大地减小了在反向工作状态下的能量损耗，提升了整体电源的效率。
电容特性: 在4V和1MHz的条件下，其电容为10pF，适合在高频电路中减少信号失真和提高响应速度。
工作温度范围: 该元件的结温范围为-55°C至150°C，可在极端环境条件下稳定工作，具有较强的适应性和可靠性。
封装与安装
RS1M 采用 SMA (DO-214AC) 封装，这种表面贴装型设计优化了散热性能和安装便利性，使得在自动化生产线上的装配更加高效。SMA 封装结构紧凑，适合高密度布局，并能在有限的空间内提供良好的电气性能。
品牌与认证
RS1M 由全球知名的安森美半导体（ON Semiconductor）制造。安森美在半导体行业享有盛誉，其产品以高品质和高可靠性闻名，适合各种工业和消费电子应用。此外，安森美的技术支持和质量保证，使用户能够在其应用中更安心地使用 RS1M。
应用领域
RS1M 二极管因其优越的性能指标，可广泛应用于：
- 开关电源: 在电源管理电路中提供高效率的整流能力，在提高功率转换效率的同时，降低发热量。
- 电动车充电系统: 由于其高耐压和高温工作能力，适用于电动汽车充电器，确保安全稳定的充电过程。
- 逆变器: 在太阳能逆变器或者变频器中，实现高效的电流转换和发电效率。
- LED 驱动电路: 快速响应时间和低反向泄漏使其适合用于高频率的LED驱动系统。
总结
RS1M 快恢复二极管以其卓越的技术规格和高效的性能，成为现代电子设备中不可或缺的重要元件。无论是高压应用，还是高频切换场合，RS1M 都能够提供稳定的性能表现，为用户的设计带来安心和保证。对于追求高效能、高可靠性的电子设计工程师而言，RS1M 是一款理想的选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
