Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ON MMUN2214LT1G
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- ON MMUN2214LT1G
- Type
- ON
- Unit
- Electronic Component
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- ON
- Electronic Component
- MMUN2214LT1G
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 NPN
- Electronic Component
- Digital Transistor
- Electronic Component
- 0.03g
- Electronic Component
- 1
- Electronic Component
- BM69417776
- Operating Temperature
- 55℃~+150℃
- Resistor
- 0.25
- Resistor
- 13kΩ
- Transistor Type
- NPN
- Power Dissipation(Pd)
- 246mW
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MMUN2214LT1G 产品概述
产品简介
MMUN2214LT1G是由安森美（ON Semiconductor）制造的一款高性能NPN数字晶体管，采用SOT-23封装，适用于表面贴装型（SMT）线路板设计。该晶体管具有优异的电气特性和可靠性，广泛应用于数字电路、开关应用和小信号放大器等场合。
主要规格
- 安装类型：表面贴装型（SMD）
- 最大集电极截止电流：500nA
- 饱和压降（Vce）：在不同的基极电流Ib和集电极电流Ic下，最大饱和压降为250mV，测试条件为300µA和10mA
- 最大集射极击穿电压（Vceo）：50V
- 最大功率耗散：246mW
- 直流电流增益（hFE）：在10V和5mA的测试条件下，最小值为80
- 最大集电极电流（Ic）：100mA
- 基极电阻（R1）: 10 kOhms
- 发射极电阻（R2）: 47 kOhms
封装和尺寸
MMUN2214LT1G采用SOT-23-3（TO-236）封装，具有小型化的优点，使得其在空间受限的应用中尤为适合。其小巧的尺寸不仅降低了PCB的占用面积，同时也有助于提高电路的设计灵活性。
应用领域
因此，MMUN2214LT1G适合于多种应用场景，包括但不限于：
开关电源：
- 由于其较大的集电极电流和低饱和压降特性，该晶体管可以用于开关电源中的开关元件，有效提高能效。
数字电路：
- 为数字逻辑电路提供信号放大和开关功能，确保快速响应并稳定运行。
音频放大：
- 适合用于音频信号放大电路，具备较好的线性增益特性，能够处理微弱的信号。
传感器驱动电路：
- 可以用于驱动各种传感器模块，尤其是在低功耗设备中，符合绿色能源和可持续发展的要求。
电机控制：
- 在小型电机控制电路中，MMUN2214LT1G的高集电极电流和低噪声特性使其能够有效驱动电机启动和停止。
设计优势
MMUN2214LT1G的设计特别注重数字信号的处理，具备以下优势：
- 低功耗特性：在较小的驱动电流下即可实现高效能，使其在便携式设备和电池供电的应用中尤为重要。
- 小型化封装：相较于传统封装，SOT-23封装大大降低了单位面积的空间需求，适应了现代电子设备对小型化的需求。
- 优良的热特性：该晶体管支持较大的功耗，具有较好的散热性能，可以在高温工作环境下正常运作。
结论
MMUN2214LT1G是功能强大且灵活的NPN数字晶体管，具备极好的电气参数和适用性，能为现代电子产品提供卓越的开关和放大能力。无论是在高效能开关电源、音频放大器还是应用于各种数字电路中，该元件都能展现出其独特的价值。其小型化、低功耗的特性，为设计工程师在开发新一代电子产品时提供了更多可能性和便利性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
