Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ON NSVBAS70LT1G
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- ON NSVBAS70LT1G
- Type
- ON
- Unit
- Electronic Component
- Minimum package
- 3000
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ON
- Electronic Component
- NSVBAS70LT1G
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.03g
- Electronic Component
- 1
- Electronic Component
- BM0264553465
- Current
- 70mA
- Diode
- 1
- Current(Ir)
- 10uA@70V
- (Vf)
- 1V@15mA
- Electronic Component
- 55℃~+150℃
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 70V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
NSVBAS70LT1G 产品概述
一、概述
NSVBAS70LT1G 是安森美（ON Semiconductor）系列的肖特基二极管，SOT-23 小封装，针对空间受限且需要低正向压降与高速恢复的电路设计。其在15mA工作点时正向压降约为1.0V，直流反向耐压可达70V，适合中低功率整流与高频开关应用。
二、主要参数
- 正向压降 (Vf)：1.0V @ 15mA
- 直流反向耐压 (Vr)：70V
- 典型整流电流：70mA（连续）
- 反向电流 (Ir)：10µA @ 70V
- 工作结温范围：-55℃ ~ +150℃
- 非重复峰值浪涌电流 (Ifsm)：所给值“100nA”疑为单位或数值错误，建议向供应商核实（此项常以A或mA为单位）
三、优势亮点
- 低正向压降：在小电流工作状态下减少功耗与热量产生，有利于电池供电或敏感模拟电路。
- 良好的高压耐受性：70V 的反向耐压使其可用于更高工作电压的电源保护与整流。
- 小封装（SOT-23）：体积小、重量轻，便于表面贴装和自动化生产，适合便携与通信设备。
- 宽温区间：-55℃至+150℃的结温范围适合工业级及严苛环境应用。
四、典型应用
- 开关电源的高速小信号整流与钳位
- 反向保护与防反接电路
- 电平移位与快速开关信号整形
- 便携式设备、通信模块、电池管理与接口保护
五、封装与热管理
SOT-23 封装体积小，热阻相对较高，连续 70mA 工作时需注意PCB散热设计：
- 在封装底部及引脚周围增加铜箔面积，改善热扩散。
- 对于脉冲或浪涌条件，评估热应力与允许的占空比。
- 遵循厂商推荐的回流焊温度曲线，避免超温损伤器件可靠性。
六、使用注意与建议
- 核实 Ifsm 的正确值与单位，避免在实际浪涌条件下误用。
- 反向电流随温度上升显著增加，若在高温环境或高反向电压下长时间工作，应进行热仿真并考虑预留裕量。
- 布局时使器件引脚与相关回路短且直，以降低寄生电感，提高开关性能。
- 如需更详细的电气特性曲线、封装尺寸及焊接工艺，请参考安森美官方数据手册或联系供应商技术支持。
如需我帮忙核对 Ifsm 正确值、查询数据手册或给出参考电路图，我可以继续提供支持。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
