WMSIC Electronic Components

ON NL17SZ32DFT2G

ON NL17SZ32DFT2G
1 / 3

Product image

ModelNL17SZ32DFT2G
PackageSOT-353
BrandON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Send RFQ Contact customer service

Technical data

Product details

20 specifications

Core information

Product name
ON NL17SZ32DFT2G
Type
ON
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ON
Electronic Component
NL17SZ32DFT2G
Electronic Component
1
Package
SOT-353
Electronic Component
Logic Gate
Electronic Component
17SZ
Electronic Component
0.028g
Electronic Component
1
Channel Count
1
Features
Electronic Component
Electronic Component
BM0127550065
Operating Temperature
55℃~+125℃
Operating Voltage
1.65V~5.5V
Logic Type
Gate

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

NL17SZ32DFT2G 产品概述

1. 产品简介

NL17SZ32DFT2G 是一款由安森美半导体（ON Semiconductor）出品的高性能 CMOS 逻辑器件，属于简单的两输入或门（OR Gate），其在现代电子应用中广泛使用。这款器件采用表面贴装型（SMD）封装，具有优良的集成特性，非常适合在多种电子电路中做逻辑运算，尤其是在对空间和功耗要求较高的应用环境中。

2. 基本参数

  • 封装类型：SC-88A（SC-70-5/SOT-353），紧凑设计，便于在空间有限的电路板上安装。
  • 输入数：2，适用于基本的逻辑功能。
  • 电路数：1，满足单通道逻辑操作。
  • 逻辑类型：或门（OR），适用于需要逻辑水平融合的应用。

3. 电气特性

  • 电压供电范围：1.65V ~ 5.5V，这使得此器件可以在广泛的电压条件下工作，适应不同的应用需求。
  • 静态电流：最大值为1µA，表明其在待机模式下的极低功耗，适合便携式设备和低功耗电路。
  • 输出电流：高、低输出均可达到32mA，能够驱动相对较大的负载，适合多种电路设计。
  • 最大传播延迟：4.5ns @ 5V，50pF，这一参数表明该器件在高速应用中也能保持较好的响应速度，适合高频率电路。

4. 工作温度

  • 该器件工作温度范围为-55°C ~ 125°C，适用于高温和低温环境，确保设备在不同的工作条件下均能正常运作，尤其适合军事、航空航天及工业控制系统。

5. 应用领域

NL17SZ32DFT2G 的特性使其在许多领域得以应用，包括：

  • 消费电子：如手机、平板电脑和其他便携式设备。
  • 工业控制：用于传感器接口和简单控制逻辑。
  • 通信设备：在数据传输和信号处理中的逻辑运算环节。
  • 汽车电子：用于汽车内部的控制逻辑，保证设备在极端温度下稳定运行。

6. 封装和安装

采用 SC-88A 封装，使得 NL17SZ32DFT2G 在安装上极为灵活，适合高密度PCB设计。表面贴装型（SMD）特性减少了对板面的需求，便于自动化生产和组装，显著提升了生产效率。

7. 结论

NL17SZ32DFT2G 作为一款高效、紧凑且可靠的CMOS逻辑器件，具备一定的灵活性和广泛的应用性，提供了理想的电气性能和节能特性。无论是在低功耗设备还是高性能电子系统中，它都可以为逻辑运算提供有效的解决方案。选择 NL17SZ32DFT2G，将为您的设计提供优质的逻辑控制能力以及提高整体系统的性能。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.