Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MC14106BDR2G 产品概述
MC14106BDR2G 是一款由安森美半导体(ON Semiconductor)生产的高性能反相器施密特触发器。这款组件在多个应用场景中表现出卓越的性能,适合用于真空管操作、数据传输、开关电源、信号整形等广泛的领域。以下是对该产品的一些关键特性及技术指标的详细介绍。
施密特触发器功能: MC14106BDR2G 的设计基于施密特触发器技术,具有良好的抗噪声特性,能够在存在电气噪声的情况下,提高信号的稳定性与可靠性。这种特性使得它非常适合于高速数字电路和其他需要数据信号清晰的应用场景。
安装类型: 此器件采用表面贴装型(SMD)封装,型号为14-SOIC(小外形集成电路),其尺寸为0.154英寸(3.90mm)宽,非常适合用于空间有限的电路板设计,提升了整体设计的灵活性。
频宽与延迟: MC14106BDR2G 在15V电源电压下,最大负载电容(CL)为50pF时,提供的最大传播延迟为80ns。这一延迟时间在快速切换应用中表现良好,确保信号传输的及时性。
宽广的供电范围: 此器件能够在3V到18V的电压范围内稳定工作,适应广泛的系统设计需求,提供了极大的灵活性。
低功耗特性: 该组件的静态电流消耗最大仅为1µA,适合于对功耗敏感的应用,例如便携式设备和低功耗电路。这种低功耗特性不仅提高了能量利用效率,还有助于延长电池寿命。
逻辑电平: MC14106BDR2G 具有高逻辑电平范围为3.6V ~ 10.8V,以及低逻辑电平范围为0.9V ~ 4V,这使得它能够灵活适应不同的逻辑电平应用,并可轻松集成到多种电路设计中。
输出特性: 该反相器具有输出电流能力,能够提供高、低逻辑电平下的驱动能力,每个输出端子可提供最多8.8mA的输出电流。这使其能够直接驱动后续电路,而无需增加外部驱动组件。
温度范围: MC14106BDR2G 能够在-55°C到125°C的极端环境中可靠工作,展示了其在严苛工业环境及汽车电子领域应用的适应性。
MC14106BDR2G 适合于多种应用领域,包括但不限于:
MC14106BDR2G 是一款集低功耗、高抗干扰能力和宽电压范围于一身的反相器施密特触发器,具有强大的适应性和灵活性,适用于多种电子设计。凭借安森美半导体出色的设计和制造能力,该产品在多年月经市场考验,已成为众多电子工程师的理想选择。无论是用于新产品开发,还是在现有产品的优化改进中,MC14106BDR2G 都能提供出色的性能支持。
通过上述详细的产品信息和特性分析,MC14106BDR2G将为任何电子设计项目提供坚实的技术基础,帮助设计师实现其设计目标。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products