WMSIC Electronic Components

ON BAS40-04LT1G BAS40

ModelBAS40-04LT1G
PackageSOT-23
BrandON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ON BAS40-04LT1G
Type
ON
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ON
Electronic Component
BAS40-04LT1G
Electronic Component
1
Package
SOT-23
Electronic Component
Schottky Diode
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM0000286631
Current
120mA
Diode
1
Current(Ir)
1uA@25V
(Vf)
1V@40mA
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BAS40-04LT1G 产品概述

产品简介

BAS40-04LT1G 是一款高性能肖特基二极管,专为低电压和快速开关应用设计。它采取表面贴装型封装(SOT-23-3),被广泛应用于各种电子设备中,如电源管理、信号整流和反向极性保护等。其优异的反向电压和电流处理能力使其在电子行业中得到广泛的青睐。

关键参数

  • 二极管类型: 肖特基二极管(Schottky Diode)
  • 电流 - 平均整流 (Io): 120mA(DC,每个二极管)
  • 不同 If 时的电压 - 正向 (Vf): 1V @ 40mA
  • 电压 - DC 反向 (Vr): 40V(最大值)
  • 反向泄漏电流: 1µA @ 25V
  • 工作温度范围: -55°C ~ 150°C
  • 封装类型: SOT-23-3(TO-236)

结构与技术

BAS40-04LT1G 采用先进的半导体技术制造,确保了其二极管配置为1对串联,适合高可靠性的电路设计。肖特基二极管的低正向电压降特性,使得该器件在工作时可以有效降低功耗,同时降低里程发热。它的反向电压能力可达到40V,适合多种输入电压系统,尤其在电源转换与信号调理电路中尤为重要。

该器件以小信号开关特性著称,能够在高达200mA的条件下保持稳定性能,适合各类快速开关应用。结合其极低的反向泄漏电流,BAS40-04LT1G 被广泛应用于高效率电源线路中,减少了待机功耗并提高了整体系统效能。

应用场景

BAS40-04LT1G 可广泛用于:

  1. 电源管理: 在AC/DC转换器、DC/DC转化器等电源管理电路中,可作为整流和反向保护元件。
  2. 电子设备保护: 利用其良好的反向电流特性,可用于防止电路中的反向电压对其他元器件造成的损害。
  3. 信号整流: 在信号处理电路中,应用该二极管进行信号整流,以减少波形失真和提高信号完整性。
  4. 消费电子产品: 在消费电子中,包括手机、便携式设备及其他电池供电的设备中,提供可靠的整流和保护功能。

性能优势

  • 低正向电压降: 相较于传统硅二极管,BAS40-04LT1G能有效降低系统能耗,特别是在高频应用中的劣化。
  • 宽工作温度范围: 可靠性高,能够在苛刻环境下稳定工作,适用于军工、航空航天和工业自动化等领域。
  • 小型化封装: SOT-23-3封装增大了设计的灵活性,使得其在空间有限的应用中表现出色。

总结

BAS40-04LT1G 以其优异的性能和广泛的应用领域,成为现代电子设计中的重要选择。无论是在电源管理、信号处理,还是电路保护中,都能为设计师提供强有力的支持,确保系统在各种条件下的高效、稳定运行。选择 BAS40-04LT1G,意味着您为项目的成功奠定了坚实的基础。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.