Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ON MMBZ27VCLT1G
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- ON MMBZ27VCLT1G
- Type
- ON
- Unit
- Electronic Component
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- ON
- Electronic Component
- MMBZ27VCLT1G
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- Electronic Component
- Type
- TVS
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.03g
- Electronic Component
- 1
- Channel Count
- Electronic Component
- Electronic Component
- BM0212455403
- Voltage
- 38V
- Electronic Component
- IEC 61000-4-2
- Current(Ir)
- 50nA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MMBZ27VCLT1G 产品概述
产品简介
MMBZ27VCLT1G 是一款由安森美半导体（ON Semiconductor）生产的齐纳二极管，专为电气过压保护和瞬态电压抑制设计。这款器件采用了SOT-23-3（TO-236）封装，适合表面贴装技术（SMT），广泛应用于电子设备中，用于保护电路免受静电放电（ESD）、浪涌电流及其他瞬态过压的影响。
基本参数
- 类型: 齐纳二极管
- 单向通道: 2
- 反向断态电压（典型值）: 22V
- 击穿电压（最小值）: 25.65V
- 最大箝位电压（不同 Ipp 情况下）: 38V
- 峰值脉冲电流: 1A（以10/1000µs脉冲测量）
- 峰值功率: 40W
- 电源线路保护: 无
- 工作温度范围: -55°C 至 150°C
- 供应商器件封装: SOT-23-3（TO-236）
应用领域
MMBZ27VCLT1G 被广泛应用于各种电子设备中，尤其是需要过压保护的电路。其典型应用包括：
- 通信设备
- 消费电子产品
- 工业控制系统
- 计算机及外围设备
- 汽车电子
设计优势
高效能保护: 齐纳二极管的特性使其能够有效吸收瞬态过压，从而保护后级电路不受损坏。其箝位电压最高可以达到38V，使其在高压情况下仍能保持稳定性能。
广泛的工作温度范围: 该器件的工作温度范围从-55°C 到 150°C，确保其在各种环境条件下均能正常工作，适合不同应用场合的需求。
紧凑的封装: SOT-23-3的封装设计使得MMBZ27VCLT1G适合现今小型化的电子产品设计，节省了电路板空间并提升了系统集成度。
高脉冲处理能力: 具备1A的峰值脉冲电流处理能力，能够适应多种高能瞬态事件，从而增强电路的可靠性。
选择理由
在选择过压保护元件时，MMBZ27VCLT1G 的高击穿电压和优越的热稳定性使其成为理想选择。此器件不仅能有效抑制过压冲击，还能在极端温度条件下表现出卓越的稳定性。此外，安森美作为一家知名的半导体制造商，确保了产品的质量和可靠性，使设计工程师在选用此器件时能够更加安心。
结论
综上所述，MMBZ27VCLT1G 是一款功能强大、应用广泛的齐纳二极管，专门设计用于电气过压保护。凭借其优越的性能参数和可靠的工作特性，该器件可以为各种电子设备提供必要的保护，确保系统的安全与稳定，是现代电子产品设计中不可或缺的元件之一。无论是在消费电子、工业应用还是汽车电子等领域，MMBZ27VCLT1G都能发挥重要作用，满足用户对性能和安全性的高要求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
