Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ON MBR0530T1G
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- ON MBR0530T1G
- Type
- ON
- Unit
- Electronic Component
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- ON
- Electronic Component
- MBR0530T1G
- Electronic Component
- 1
- Package
- SOD-123
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.036g
- Electronic Component
- 1
- Electronic Component
- BM69415148
- Current
- 500mA
- Diode
- 1
- Current(Ir)
- 130uA@30V
- (Vf)
- 430mV@500mA
- Electronic Component
- 65℃~+125℃
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：MBR0530T1G
基本信息
MBR0530T1G是安森美（ON Semiconductor）推出的一款高性能肖特基二极管，采用表面贴装封装形式SOD-123，特别适合于各种电子应用的电力管理和信号整流。该产品的设计考虑了高效能和可靠性，适合在极端温度和电气条件下工作。
主要参数
- 安装类型：表面贴装型（SMD）
- 二极管类型：肖特基二极管
- 电流 - 平均整流 (Io)：500mA
- 正向电压 (Vf)：430mV @ 500mA
- 反向耐压 (Vr)：最大30V
- 反向饱和电流：130µA @ 30V
- 工作温度范围：-65°C ~ 125°C
- 速度：快速恢复 =< 500ns，> 200mA（Io）
- 封装类型：SOD-123
性能特点
高效的整流性能：MBR0530T1G的Average Rectified Current（Io）可达500mA，适合要求中等电流的高效整流应用。其低正向压降（Vf）为430mV（在500mA条件下），使其在高电流下依然保持较低的功率损耗，极大地提高了能效。
低反向泄漏电流：反向泄漏电流在30V条件下仅为130µA，这意味着在正常工作的情况下，该二极管只会对电路引入极小的能量损耗，增强了系统的整体效率。
快速恢复特性：该二极管具有快速恢复特性，恢复时间小于500ns，能够有效减少在高频转换过程中引入的干扰和信号失真，适合提升开关电源与高频电路的性能稳定性。
宽广的工作温度范围：-65°C到125°C的工作温度范围让MBR0530T1G能够在极端的环境中可靠运行，适合航空航天、汽车电子及其他特殊行业的应用需求。
应用领域
MBR0530T1G的多种特性使其适用于广泛的应用场景：
- 电源管理：在开关电源、同步整流中实现高效整流，以提升电源效率和降低热量产生。
- 电动汽车：适用于电动汽车的电池管理系统，帮助改善电池充放电效率。
- 通信设备：在无线通信以及其他信号传输设备中，作为整流和保护元素有助于提高系统的可靠性。
- 消费电子产品：在各种消费电子产品中，用于电源的整流和线路保护，提供更稳定的工作条件。
包装与可用性
MBR0530T1G采用小型的SOD-123封装，适合于高密度的电路板设计。其表面贴装的特点也使得其在自动化装配过程中更加便捷。安森美提供高质量的产品保证，同时产品在许多电子元器件供应商中都能轻松获取，可确保快速交货，满足用户需求。
总结
MBR0530T1G是一款高性能、低功耗的肖特基二极管，适合多种应用场景。其优秀的整流特性、低漏电流以及宽广的工作温度范围使其成为现代电子设备中理想的选择。凭借安森美的品牌信誉和良好的产品设计，MBR0530T1G定能为用户的设计增添更高的价值和可靠性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
