WMSIC Electronic Components

ON MMBZ33VALT1G

ModelMMBZ33VALT1G
PackageSOT-23
BrandON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ON MMBZ33VALT1G
Type
ON
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ON
Electronic Component
MMBZ33VALT1G
Electronic Component
1
Package
SOT-23
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.03g
Electronic Component
1
Channel Count
Electronic Component
Electronic Component
BM0000080969
Operating Temperature
55℃~+150℃
Voltage
46V
Electronic Component
IEC 61000-4-2

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MMBZ33VALT1G 产品概述

产品简介

MMBZ33VALT1G是一款由安森美半导体(ON Semiconductor)生产的齐纳二极管,专为过压保护和电源线路的瞬态压制应用设计。它采用了表面贴装型SOT-23-3(TO-236)封装,使其在各种电子设备中具有广泛的适用性和卓越的性能。该元器件在ESD(静电放电)保护、电源管理和信号完整性保护等领域表现出色,是当今电子设计中不可或缺的重要组件。

主要参数

  • 类型:齐纳二极管,具有单向通道(2个)。
  • 反向电压:在典型工作条件下,MMBZ33VALT1G的反向断态电压为26V。
  • 击穿电压:当电压达到31.35V时,二极管会进入击穿状态,开始导通,从而有效限制电压过高的风险。
  • 过压钳位:最大电压钳制值为46V,确保在极端情况下能够有效地抑制电压高峰,保护后续电路不会受到损害。
  • 峰值脉冲电流:在10/1000µs脉冲宽度下,该元器件可以承受的峰值电流达870mA,为电路提供良好的保护能力。
  • 峰值功率:该二极管能够承受的峰值功率为40W,适用于大多数需要瞬态电流抑制的应用场景。
  • 工作温度范围:MMBZ33VALT1G在-55°C至150°C的广泛工作温度范围内表现稳定,适合高温或低温环境下的应用。
  • 封装形式:采用流行的SOT-23-3封装,具有小型化、轻量化的特点,便于电路板设计和集成。

应用场景

MMBZ33VALT1G广泛应用于以下领域:

  1. 电源保护:用于电源电路的过压保护,有效防止电源瞬态电压对电路的损害。
  2. 数据线保护:对USB和HDMI等引脚标准产品提供静电放电(ESD)保护,确保信号传输的稳定性和完整性。
  3. 消费电子:在智能手机、平板电脑和其他多媒体设备中,用于保证内置电路的安全操作,防止电压冲击。
  4. 通讯设备:在网络设备中防止信号干扰和电压瞬变对设备的影响。
  5. 汽车电子:在车载电子模块中使用,保护控制单元和传感器免受过电压损害,确保车辆安全操作。

设计优势

  1. 高可靠性:由于该二极管的高击穿电压和耐受峰值功率,它能够在较高的压力下稳定运行,长期保护电路。
  2. 高度集成:小型SOT-23-3封装使得MMBZ33VALT1G非常适合高密度电路板设计,节省空间并降低整体成本。
  3. 广泛的工作温度:适应极端环境的能力使其在各种应用中具备良好的兼容性,进一步提高了设计灵活性。
  4. 优异的ESD保护:在需要ESD保护的应用中,这款二极管具有卓越的表现,有效延长设备的使用寿命。

结论

MMBZ33VALT1G凭借其优越的性能、可靠的工作特性以及多样的应用场景,成为了现代电子设计中保护电路的理想选择。安森美的这一产品不仅满足了电子工程师对高性能器件的需求,同时也提供了极佳的性价比,是各类电子产品设计中的理想伙伴。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.