WMSIC Electronic Components

ON NCP114BSN330T1G

ModelNCP114BSN330T1G
PackageTSOP-5
BrandON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ON NCP114BSN330T1G
Type
ON
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
200mV@(300mA)
Electronic Component
ON
Electronic Component
70uVrms
Electronic Component
NCP114BSN330T1G
Electronic Component
1
Package
TSOP-5
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.3g
Electronic Component
1
Electronic Component
BM0265088218
Operating Temperature
40℃~+85℃@(Tj)
Operating Voltage
5.5V
Output
Electronic Component
Output Voltage
3.3V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

NCP114BSN330T1G 300mA CMOS低压差线性稳压器(LDO)产品概述

NCP114BSN330T1G是安森美(ON Semiconductor)推出的单通道固定正输出CMOS低压差线性稳压器,专为低功耗、小型化、噪声敏感型电子设备设计。其核心参数覆盖300mA输出能力、低静态电流、高纹波抑制等关键特性,适配从便携消费电子到工业物联网的多场景应用。

一、产品核心定位与核心优势

作为安森美LDO产品线的低功耗主力型号,NCP114BSN330T1G的设计重点在于平衡效率、噪声控制与体积,核心优势体现在:

  1. 低待机功耗:56μA静态电流(Iq)远低于同类产品(多数竞品Iq>100μA),适合电池供电设备长待机;
  2. 高纹波抑制:75dB@1kHz PSRR,有效过滤开关电源、电池纹波干扰;
  3. 低噪声输出:70μVrms宽频噪声,满足模拟传感器、音频电路信号质量要求;
  4. 小封装集成:TSOP-5封装体积紧凑(1.6mm×2.9mm),适配智能手环、传感器节点等小型设备;
  5. 宽温可靠性:-40℃~+85℃工作结温,覆盖户外、工业复杂环境。

二、关键电气参数深度解析

NCP114BSN330T1G参数针对低功耗场景优化,匹配度高:

1. 电压与电流特性

  • 输入输出:固定3.3V输出,最大输入5.5V(适配锂电池3.7V、5V电源);
  • 低压差:满载300mA时压差仅200mV,输入≥3.5V即可稳定输出,电池续航更持久;
  • 输出能力:300mA持续电流,可驱动低功耗MCU(如STM32L系列)、蓝牙模块、小型传感器。

2. 纹波与噪声控制

  • PSRR:75dB@1kHz,将1kHz输入纹波衰减至1/3160,大幅降低后级干扰;
  • 输出噪声:70μVrms(10Hz~100kHz),避免噪声耦合到模拟信号,适合压力传感器、麦克风前置放大。

3. 静态电流与功耗

待机(负载<1mA)时Iq仅56μA,若设备每天待机12小时、工作12小时(平均负载100mA),年待机功耗比高Iq产品低约30%,显著延长电池寿命。

三、封装形式与典型应用场景

1. TSOP-5封装特点

超薄小外形封装,引脚间距0.5mm,尺寸1.6mm×2.9mm×1.1mm,支持SMT,适配高密度PCB,适合穿戴、IoT节点等体积敏感场景。

2. 核心应用场景

  • 便携消费电子:智能手环、蓝牙耳机、智能手表核心供电(驱动MCU、蓝牙、传感器);
  • 物联网节点:温湿度/气压传感器、低功耗WiFi模块稳压(宽温适配户外);
  • 工业控制辅助:小型PLC、远程传感器供电(-40℃~+85℃覆盖车间、基站);
  • 音频与模拟电路:耳机放大器前置稳压、低噪声传感器信号调理(低噪声提升信号质量)。

四、内置保护机制与可靠性

NCP114BSN330T1G内置双重保护,提升抗故障能力:

  1. 过热保护(OTP):结温超阈值(典型150℃)时自动关断输出,温度回落自动恢复,无需手动复位;
  2. 过流保护(OCP):输出电流超300mA(短路限制350mA)时,限制电流或关断,保护负载与自身。

CMOS工艺高集成度使器件长期可靠性高,MTBF符合工业级标准。

五、典型应用设计注意事项

确保稳定工作需注意:

  1. 电容配置:输入并联0.1μF陶瓷电容(近引脚),输出并联1μF陶瓷电容(ESR<1Ω);
  2. 负载匹配:避免持续超300mA负载,大负载可并联同型号器件;
  3. 散热设计:满载功耗0.66W,需PCB接地铜箔≥10mm²辅助散热;
  4. 浪涌防护:输入含浪涌时(如汽车电源),前端串联TVS管(如SMBJ5.5CA)防过压。

综上,NCP114BSN330T1G是低功耗、小型化场景的高性价比LDO,参数与保护机制覆盖便携、IoT、工业辅助应用,是稳压模块的可靠选择。

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