WMSIC Electronic Components

ON MC74VHC1G00DFT1G

ModelMC74VHC1G00DFT1G
PackageSOT-353
BrandON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ON MC74VHC1G00DFT1G
Type
ON
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ON
Electronic Component
MC74VHC1G00DFT1G
Electronic Component
1
Package
SOT-353
Electronic Component
Logic Gate
Electronic Component
74VHC
Electronic Component
0.029g
Electronic Component
1
Channel Count
1
Electronic Component
BM0257640963
Operating Temperature
55℃~+125℃
Operating Voltage
2V~5.5V
Logic Type
and Gate
Current(IOH)
8mA
Current(IOL)
8mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:MC74VHC1G00DFT1G

MC74VHC1G00DFT1G是一款基于CMOS技术的高性能逻辑门电路,具体功能为与非门(NAND Gate)。该器件由著名的半导体制造公司ON Semiconductor(安森美)生产,旨在满足现代电子设计中对高速、高效、低功耗逻辑组件的需求。它广泛应用于各种电子产品,包括数字信号处理、数据存储、计算机外围设备等领域。

基础参数

  1. 逻辑类型:与非门

    • 该器件实现的是与非逻辑,输入信号的与操作结果取反。若两个输入均为高电平,则输出低电平。其余情况下,输出为高电平,使其成为一种基本且重要的逻辑门电路。
  2. 电路数:1

    • MC74VHC1G00DFT1G内含一个独立的逻辑功能单元,适合简单逻辑电路的设计需求。
  3. 输入数:2

    • 此与非门设计支持两个输入,常用于多种逻辑组合,以实现复杂的逻辑运算。
  4. 电压 - 供电:2V ~ 5.5V

    • 该组件可以在较宽的电压范围内工作,适应不同电源电压的电路设计,可与3.3V及5V系统兼容使用,从而提升其应用的灵活性。
  5. 电流 - 静态(最大值):1µA

    • 在静态条件下,该器件的最大工作电流为1µA,这显示了其极低的静态功耗,适合需要长时间待机或电池供电的应用场景。
  6. 电流 - 输出高、低:8mA

    • 不论输出状态为高或低,MC74VHC1G00DFT1G在驱动负载时均可输出最大8mA的电流,这支持较强的驱动能力,适合直接连接LED或其他负载电路。
  7. 逻辑电平:低电平 (0.5V ~ 1.65V), 高电平 (1.5V ~ 3.85V)

    • 明确的逻辑电平范围使器件与各种数字电路保持兼容,适应不同电平标准的设计需求。
  8. 最大传播延迟:7.5ns @ 5V,50pF

    • 该器件在最大负载条件下(50pF电容)可实现的最大传播延迟为7.5纳秒,显示出其在高速应用场合下的优越性能。
  9. 工作温度:-55°C ~ 125°C

    • 广泛的工作温度范围使MC74VHC1G00DFT1G具备良好的环境适应性,适合于汽车电子、工业设备等苛刻环境中的应用。

设计和封装

  • 安装类型:表面贴装型

    • 该功能器件采用表面贴装技术(SMD),方便现代电子电路的自动化组装,提高生产效率。
  • 供应商器件封装:SC-88A(SC-70-5/SOT-353)

    • 其封装尺寸小巧,适合高密度PCB设计,能够有效节省电路板空间。

应用领域

MC74VHC1G00DFT1G由于其高性能和多样的参数设置,广泛应用于:

  • 数字电路和逻辑电路设计
  • 计算机和处理器外围接口
  • 各类传感器数据处理
  • 家电和消费电子产品
  • 通信设备及网络硬件

结语

总而言之,MC74VHC1G00DFT1G是一款性能优越、高度集成的与非门逻辑器件,完美适合于电池供电、低功耗及要求高速度数据处理的应用场景。其宽广的电压供电范围和可靠的工作温度,确保了这款产品在不同环境下的稳定性能,是个人和企业设计中不可或缺的理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.